Method of cutting light-emitting device chip wafer by using laser scribing
AssigneeSamsung Electronics Co., Ltd.
InventorYu-sung JANG
Life of this patent
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Abstract
Methods of cutting a light-emitting device chip wafer by using a laser scribing process. The method includes: preparing a wafer that has a plurality of semiconductor chips on an upper surface of the wafer; attaching a first tape covering the semiconductor chips to the upper surface of the wafer; forming scribing lines to define each of the semiconductor chips on the wafer by irradiating a laser beam onto a lower surface of the wafer; attaching a second tape to the lower surface of the wafer; and breaking the wafer into a plurality of chips by applying a physical force to the wafer along the scribing lines.
Claims6
A method of cutting a wafer, the method comprising:
- preparing the wafer having a plurality of semiconductor chips on an upper surface of the wafer;
- attaching a first tape covering the semiconductor chips to the upper surface of the wafer;
- forming scribing lines to define each of the semiconductor chips on the wafer by irradiating a laser beam onto a lower surface of the wafer;
- attaching a second tape to the lower surface of the wafer;
- and
- breaking the wafer into a plurality of chips by applying a physical force to the wafer along the scribing lines.
Dependencies are inferred from the claim text.