Method for Collective Fabrication of 3D Electronic Modules Comprising Only Validated PCBs

A method for the collective fabrication of 3D electronic modules, comprising:

• fabricating a stack of N reconstructed wafers, where N≧1, being KGRWs, each comprising only identical patterns validated after an electrical test, one pattern comprising at least one active and/or passive silicon component, at least one reconstructed wafer comprising active components, this stack including a redistribution layer with a maximum of 4 interconnection levels;
• fabricating a panel of identical passive printed circuits comprising only passive printed circuits comprising at least 6 interconnection levels and validated after a test, which comprises:
• fabrication of a panel of identical printed circuits,
• electrical testing of each printed circuit,
• fitting of the validated printed circuits after this test to an adhesive substrate,
• moulding of the mounted circuits in an electrically insulating resin of the epoxy type, called coating resin and polymerization of the resin,
• and
• removal of the adhesive substrate, a panel comprising only validated printed circuits, being a panel of KGRPs, being thus obtained after this step;
• bonding the panel of KGRPs with a stack of KGRWs, in order to form a stack of KGRWs-KGRP panel assembly;
• and
• cutting the stack of KGRWs-KGRP panel assembly along cutting lines for the purpose of obtaining the 3D electronic modules.