Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution composition

An aqueous polyimide precursor solution composition, wherein

• a polyamic acid formed by the reaction of a tetracarboxylic dianhydride and a diamine, which has a solubility in water at 25° C. of 0.1 g/L or more, is dissolved in an aqueous solvent together with an imidazole, and
• the aqueous polyimide precursor solution composition has an organic solvent content of less than 5%.

An aqueous polyimide precursor solution composition, wherein

• a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, and consists of a repeating unit represented by the following formula (1), is dissolved in an aqueous solvent together with an imidazole having two or more alkyl groups as substituents in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.
• wherein A represents a tetravalent group of an aromatic tetracarboxylic acid having two to three aromatic rings, from which carboxyl groups have been removed, and B represents a divalent group of an aromatic diamine having one to two aromatic rings and having a solubility in water at 25° C. of 0.1 g/L or more, from which amino groups have been removed.

A method for producing an aromatic polyimide seamless belt, comprising:

• heating an aqueous polyimide precursor solution composition, in which a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, and consists of a repeating unit represented by the following formula (1), is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.
• wherein A represents a tetravalent group of an aromatic tetracarboxylic acid, from which carboxyl groups have been removed, and B represents a divalent group of an aromatic diamine having a solubility in water at 25° C. of 0.1 g/L or more, from which amino groups have been removed.

A binder resin composition for electrodes, wherein

• a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, and consists of a repeating unit represented by the following formula (1), is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.
• wherein A represents a tetravalent group of an aromatic tetracarboxylic acid, from which carboxyl groups have been removed, and B represents a divalent group of an aromatic diamine having a solubility in water at 25° C. of 0.1 g/L or more, from which amino groups have been removed.

A polyimide precursor resin composition for flexible device substrates, wherein

• a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, and consists of a repeating unit represented by the following formula (1), is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.
• wherein A represents a tetravalent group of an aromatic tetracarboxylic acid, from which carboxyl groups have been removed, and B represents a divalent group of an aromatic diamine having a solubility in water at 25° C. of 0.1 g/L or more, from which amino groups have been removed.