Laser-bonded component and production method for same
AssigneePanasonic Corporation
InventorsYukio Nishikawa, Tomomi Tanaka, Toshiki Itoi, Yoshiaki Kobayashi
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AssigneePanasonic Corporation
InventorsYukio Nishikawa, Tomomi Tanaka, Toshiki Itoi, Yoshiaki Kobayashi
Estimating the term…
Provided are a laser-bonded component and a production method for same that ensure sufficient bonding strength using little laser energy and which cause little increase in surrounding temperature. A nickel layer, being a surface layer, is formed having sufficient thickness on the upper surface of a copper plate that is uppermost amongst at least two superposed copper plates, a laser is irradiated from above the nickel layer, a re-solidification section formed by fusing and alloying the copper in the copper plates and the nickel in the nickel layer is formed through to inside the bottommost copper plate, and the copper plates are bonded together. The re-solidification section having high breaking strength is formed by the alloying of the nickel and the copper. As a result, the copper plates can be bonded with a small welding surface area and little laser energy.
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A laser-bonded component, comprising:
Dependencies are inferred from the claim text.