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US 2013/0171392 A1Published application
Device housing and method for manufacturing same
AssigneesFIH (Hong Kong) Limited, Shenzhen Futaihong Precision Industry Co., Ltd.
InventorsREN-BO WANG, XIN-WU GUAN
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Abstract
A device housing for electronic device includes a substrate comprising activated carbon particles and adhesive material for bonding and rigidifying the activated carbon particles; and a decorative coating directly formed on a surface of the substrate. A method for manufacturing the device housing is also described.
Claims18
A device housing, comprising:
- a substrate comprising activated carbon particles and adhesive material for bonding and rigidifying the activated carbon particles;
- and
- a decorative coating directly formed on a surface of the substrate.
A method for manufacturing a device housing, comprising:
- blending activated carbon particles and an adhesive material to form a paste mixture;
- dry-pressing the paste mixture to form a solidified plate;
- treating the plate by a first steam activation process;
- forming a substrate having a desired device housing shape by machining the plate;
- forming a decorative coating directly on a surface of the substrate;
- and
- treating the substrate with the decorative coating by a second steam activation process.
4 more elements
Dependencies are inferred from the claim text.