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US 2013/0171335 A1Published application
Thin film depositing apparatus and the thin film depositing method using the same
OwnerYong-Suk Lee, Myung-Soo Huh +6inventors
InventorsYong-Suk Lee, Myung-Soo Huh, Cheol-Rae Jo, Sang-Hyuk Hong, Jeong-Ho Yi, Suk-Won Jung, Sun-Ho Kim, Mi-Ra An
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Abstract
A thin film depositing apparatus and a thin film deposition method using the apparatus. The thin film depositing apparatus includes a chamber configured to have a substrate mounted therein, an ejection unit configured to move in the chamber and to eject a deposition vapor to the substrate, and a source supply unit configured to supply a source of the deposition vapor to the ejection unit.
Claims20
A thin film depositing apparatus, comprising:
- a chamber configured to have a substrate mounted therein;
- an ejection unit configured to move in the chamber and to eject a deposition vapor to the substrate;
- and
- a source supply unit configured to supply a source of the deposition vapor to the ejection unit.
1 more element
A thin film deposition method, comprising:
- preparing an ejection unit for ejecting a deposition vapor in a chamber,
- preparing a source supply unit for supplying a source of the deposition vapor to the ejection unit in the chamber;
- mounting a substrate in the chamber;
- supplying the source to the ejection unit by operating the source supply unit;
- moving the ejection unit with respect to the substrate;
- and
- ejecting the deposition vapor.
4 more elements
Dependencies are inferred from the claim text.