Backlight Unit Integrally Formed with Conductive, Chemically Toughened Glass and Method for Fabricating the same

A backlight unit integrally formed with conductive, chemically toughened glass, comprising:

• a light guide layer in the form of a transparent substrate having the shape of a thin plate and made of chemically toughened glass with a thickness ranging from 0.1 mm to 5 mm;
• a conductive film being transparent and made of conductive material forming a predetermined circuit pattern on the transparent substrate of the light guide layer using photochemical lithography or laser beam, and having a surface resistance in the range of 4.5Ω/□ to 650Ω/□;
• a diffusion layer for scattering light from emitting surface uniformly into a planar light source and adjusting the color temperature of the planar light source, the diffusion layer being made of transparent resin, diffusing particles and dye in different proportions, and having a light transmittance in the range of 30% to 98%;
• an optical microstructure layer made of high refractive index material and forming a predetermined optical microstructure pattern on the transparent substrate of the light guide layer using photochemical lithography or coating-printing process, the optical microstructure layer being used for refracting incident light with its predetermined optical microstructure pattern;
• the predetermined optical microstructure pattern being adjustable to adjust the distribution of incident light from a planar light source module;
• a transparent layer made of transparent resin coated on the reflective surface of transparent substrate of light guide layer and optical microstructure layer using coating-printing process to allow the passage of light ray not refracted by the optical microstructure layer to a reflective layer;
• a reflective layer mainly for reflecting the light ray having passed through the transparent layer to the light guide layer, which is then refracted by the optical microstructure layer to the diffusion layer;
• and
• a light source module consisting of conductive material, a plurality of light emitting diodes and flexible circuit boards and being adhered and connected to the electrode circuit with a predetermined pattern on the conductive film using ultrasonic hot melt adhesive process, the light source module being used mainly for providing an incident light source in the integrally formed backlight unit to illuminate the connected keyboard or non-self-luminous display panel.