Extrusion-based additive manufacturing system for 3d structural electronic, electromagnetic and electromechanical components/devices
AssigneeBoard of Regents, The University of Texas System
InventorsRyan B. Wicker, Eric MacDonald, Francisco Medina, David Espalin, Danny W. Muse
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Abstract
The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.
Claims70
A method of making a three-dimensional electronic, electromagnetic or electromechanical component/device comprising the steps of:
- creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities;
- filling the interconnection cavities with a conductive material;
- and
- placing one or more components in the component cavities.
A three-dimensional electronic, electromagnetic or electromechanical component/device made by a method comprising the steps of (a) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities, (b) filling the interconnection cavities with a conductive material, and (c) placing one or more components in the component cavities.
A system for making a three-dimensional electronic, electromagnetic or electromechanical component/device comprising.
- a three-dimensional printing device that creates one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities;
- a first machine that fills the interconnection cavities with a conductive material;
- and
- a component placement machine that places one or more components in the component cavities.
A computer program embodied on a non-transitory computer readable medium for making a three-dimensional electronic, electromagnetic or electromechanical component/device, the computer program comprising:
- a code segment for creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities;
- a code segment for filling the interconnection cavities with a conductive material;
- and
- a code segment for placing one or more electronic components in the electronic component cavities.
Dependencies are inferred from the claim text.