Circuit module with multiple submodules
AssigneeStmicroelectronics Pte Ltd
InventorsKahWee GAN, Yaohuang HUANG
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AssigneeStmicroelectronics Pte Ltd
InventorsKahWee GAN, Yaohuang HUANG
Estimating the term…
An embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has a first submodule node, and the second submodule is disposed over the first submodule and has a second submodule node. The conductive structure couples the first submodule node to one of the module nodes and couples the second submodule node to one of the module nodes. Another embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has first submodule nodes, and the second submodule is disposed over the first submodule and has second submodule nodes. The conductive structure couples one of the first and second submodule nodes to one of the module nodes and couples one of the first submodule nodes to one of the second submodule nodes.
A circuit module, comprising:
A circuit module, comprising:
A system, comprising:
A system, comprising:
A method, comprising:
A method, comprising:
Dependencies are inferred from the claim text.