Adhesive dam
AssigneeStmicroelectronics Pte Ltd
InventorsJing-En Luan, Hk Looi
Life of this patent
Estimating the term…
Abstract
On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the operation of the circuit. A contact pad can be provided at a selected location and with a selected shape, and solder deposited on the pad, then reflowed to form the dam. The dam can be a structure soldered to a contact pad, or the dam can be supported at its ends by another structure of the device, so that, at the location where it functions to contain the adhesive, it is not attached to the substrate.
Claims23
A device comprising:
- a circuit substrate;
- a first component positioned on the circuit substrate, coupled to the circuit substrate by an adhesive;
- a second component positioned adjacent to the first component on the circuit substrate;
- and
- an adhesive dam positioned between the first and second components, sufficiently close to the first component that a portion of the adhesive that couples the first component to the circuit substrate is in direct physical contact with the adhesive dam, and does not extend on the circuit substrate to a side of the adhesive dam opposite the first component.
A device comprising:
- a circuit substrate;
- a circuit component positioned on the circuit substrate;
- an adhesive joint mechanically coupling the circuit component to the circuit substrate;
- and
- an adhesive dam positioned on the circuit substrate adjacent to the adhesive joint and having a first side facing the circuit component and a second side facing away from the circuit component, material of the adhesive joint making direct contact with the first side of the adhesive dam but not with the second side of the adhesive dam.
A method, comprising:
- positioning a first component on a circuit board with an electrical connector of the first component positioned over a first contact pad of the circuit board;
- coupling the electrical connector to the first contact pad by reflowing solder and forming a solder joint on the first contact pad;
- positioning an adhesive dam on the circuit board;
- dispensing adhesive on the circuit board adjacent to the adhesive dam;
- positioning a second component in contact with the adhesive;
- and
- coupling the second component to the circuit board by curing the adhesive, with a portion of the adhesive in contact with the adhesive dam.
Dependencies are inferred from the claim text.