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US 2013/0170154 A1Published application
Printed circuit board having embedded capacitor and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDoo Hwan LEE, Jong In RYU, Jin Won LEE, Moon Il KIM
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Abstract
Provided is a printed circuit board having an embedded capacitor including at least one sheet-shaped capacitor, an insulating material configured to cover the sheet-shaped capacitor, and a capacitor device mounted in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor, improving reliability of the substrate.
Claims20
A printed circuit board having an embedded capacitor comprising:
- at least one sheet-shaped capacitor;
- an insulating material configured to cover the sheet-shaped capacitor;
- and
- a chip capacitor mounted in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor.
1 more element
A method of manufacturing a printed circuit board having an embedded capacitor comprising:
- forming at least one sheet-shaped capacitor and an insulating material configured to cover the sheet-shaped capacitor;
- and
- mounting a chip capacitor in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor.
Dependencies are inferred from the claim text.