Package carrier and manufacturing method thereof

A manufacturing method of a package carrier, comprising:

• providing a supporting board having an upper surface;
• forming a patterned circuit layer on the upper surface of the supporting board, wherein the patterned circuit layer exposes a portion of the upper surface of the supporting board;
• laminating an insulating layer and a conductive layer located at a first surface of the insulating layer onto the patterned circuit layer, wherein the insulating layer covers the patterned circuit layer and the portion of the upper surface of the supporting board exposed by the patterned circuit layer;
• forming a plurality of conductive connection structures on the patterned circuit layer;
• patterning the conductive layer to define a plurality of pads respectively connected to the conductive connection structures and to expose a portion of the first surface of the insulating layer;
• and
• removing the supporting board to expose a second surface opposite to the first surface of the insulating layer, wherein the second surface of the insulating layer and a bonding surface of the patterned circuit layer are coplanar.