Electronic device with heat sink mechansim
AssigneesHon Hai Precision Industry Co., Ltd., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
InventorHONG LI
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Abstract
An electronic device includes an electronic component and a heat sink mechanism. The electronic component includes at least one heat sink portion defining a plurality of heat sink holes. The heat sink mechanism includes at least one first conducting portion secured to an end of the heat sink holes, for dissipating heat produced by the electronic component away from the electronic device.
Claims12
An electronic device comprising:
- an electronic component comprising at least one heat sink portion defined a plurality of heat sink holes;
- and
- a heat sink mechanism for dissipating heat generated by the electronic component;
- wherein the heat sink mechanism comprises at least one first conducting portion secured to an end of the heat sink holes, for dissipating the heat produced by the electronic component away from the electronic device.
The electronic device as claimed in claim 2, wherein the heat sink mechanism comprises a first heat sink component arranged on a surface of the electronic component, the at least one first conducting portion extends from the first heat sink component, for securing the first heat sink component to the electronic component.
Dependencies are inferred from the claim text.