Electronic device

An electronic device which comprises:

• a first glass substrate having a first surface having a first sealing region;
• a second glass substrate having a second surface having a second sealing region corresponding to the first sealing region and disposed so that the second surface faces the first surface of the first glass substrate with a predetermined gap;
• an electronic element portion provided between the first glass substrate and the second glass substrate;
• and
• a sealing layer formed between the first sealing region of the first glass substrate and the second sealing region of the second glass substrate so as to seal the electronic element portion, the sealing layer comprising a melt-bonded layer of a sealing material containing a sealing glass, a low expansion filler and a laser absorbent;
• wherein the sealing layer has a fluidity inhibition value of from 0.7 to 1.3 μm−1, the fluidity inhibition value being represented by the sum of perimeters of the low expansion filler and the laser absorbent present in a unit area of a cross-section of the sealing layer;
• and the sealing layer has a thermal expansion value of from 50 to 90×10−7/° C., the thermal expansion value being represented by the sum of a value that is the area ratio of the sealing glass in the unit area of the cross-section of the sealing layer multiplied by the thermal expansion coefficient of the sealing glass, and a value that is the area ratio of the low expansion filler and the laser absorbent in the unit area of the cross-section of the sealing layer multiplied by the thermal expansion coefficient of the low expansion filler.