Method of manufacturing multi-layer wiring board

A method of manufacturing a multi-layer wiring board, comprising:

• forming, on a supporting substrate, a first laminated structure in which at least one conductor layer and at least one resin insulating layer are alternately formed;
• forming a core substrate on the first laminated structure so as to come into contact with a conductor layer which is an uppermost layer of the first laminated structure;
• forming a through hole by emitting laser light to the core substrate;
• forming a through hole metal layer on at least an inner circumferential surface of the through hole;
• and
• forming a second laminated structure in which at least one conductor layer and at least one resin insulating layer are alternately formed on the core substrate having the through hole metal layer formed thereon,
• wherein a thickness of the conductor layer which is the uppermost layer of the first laminated structure is greater than a thickness of other conductor layers.