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US 2013/0160289 A1Published application
One-pack type epoxy resin composition and use thereof
OwnerMitsuo Ito, Tomohiro Fukuhara +1inventors
InventorsMitsuo Ito, Tomohiro Fukuhara, Seiji Nakajima
Life of this patent
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Abstract
Disclosed is a one-pack type epoxy resin composition containing an epoxy resin, dicyandiamide, an epoxy resin adduct compound, and a non-latent imidazole compound. The one-pack type epoxy resin composition is capable of being cured at a low temperature, while having excellent heat resistance and sealing properties. Also disclosed is use of the one-pack type epoxy resin composition.
Claims6
-8. (canceled)
A method of producing a relay mounted on a substrate, the method comprising:
- applying a one pack epoxy resin composition entirely or partially to a formed member of a relay and/or a mental terminal, to closely adhere the formed member of the relay to the mental terminal, the one-pack type epoxy resin composition comprising an epoxy resin, dicyandiamide, an epoxy resin adduct compound, and at least one non-latent imidazole compound, wherein, with respect to 100 parts by weight of the epoxy resin, the dicyandiamide is in an amount of 10 parts by weight, the epoxy resin adduct compound is in an amount of 10 parts by weight, and the non-latent imidazoic compound is in an amount of 10 parts by weight;
- curing the one-pack epoxy resin composition by heating the one-pack epoxy resin composition to a temperature in a range of 60° C. to 120° C., to prepare the relay;
- and
- performing a reflow process to the relay with use of a lead-free solder, so that the solder is to be in a temperature in a range of 250° C. to 260° C., to mount the relay onto a substrate.
1 more element
Dependencies are inferred from the claim text.