Apparatus and method for manufacturing double-sided mounting substrate

An apparatus for manufacturing a double-sided mounting substrate, in which a printed circuit board with mounted electronic components mounted on upper and lower surfaces of the printed circuit board is carried to a mounting position, new electronic components are mounted on the upper surface of the printed circuit board at the mounting position, and the printed circuit board is carried away from the mounting position after the new electronic components are mounted, the apparatus comprising:

• a backup table provided under the printed circuit board at the mounting position which supports the lower surface of the printed circuit board;
• and
• a servo motor which elevates and lowers the backup table,
• wherein the servo motor elevates the backup table to mount the new electronic components and lowers the backup table to carry-in and to carry-away the printed circuit board based on a lower limit position of the backup table, and
• wherein the lower limit position of the backup table comprises a position separated downwardly from a reference surface at the mounting position by a distance obtained by adding a preset clearance to a sum of a maximum height of the mounted electronic components mounted on the lower surface of the printed circuit board and a thickness of the printed circuit board.