# US 2013/0159570 A1 · Computer data transmitting system and motherboard using the same

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- Number: US 2013/0159570 A1
- Document ID: US20130159570A1
- Status: Published application
- Kind: A1
- Application number: 13/426,922
- Filed: 2012-03-22
- Published: 2013-06-20
- Earliest claimed: 2011-12-19
- Assignees: Hon Hai Precision Industry Co., Ltd.
- Inventors: BING-HENG LEE
- Web page: https://patentgrep.com/patent/US20130159570A1

## CPC

- H04B 10/801: {using optical interconnects, e.g. light coupled isolators, circuit board interconnections}
- H04B: TRANSMISSION

## Abstract

A computer data transmitting system includes a PCI-E interface, a CPU, a first photoelectric conversion module, and a second photoelectric conversion module. The first photoelectric conversion module is electrically connected to the PCI-E interface. The second photoelectric conversion module is electrically connected to the CPU. The first photoelectric conversion module and the second photoelectric conversion module are connected to each other by at least one optical fiber. A motherboard using the computer data transmitting system is also provided.

## Claims

### Claim 1

A computer data transmitting system, comprising:
a Peripheral Component Interconnect Express (PCI-E) interface;
a Central Processing Unit (CPU);
a first photoelectric conversion module electrically connected to the PCI-E interface;
a second photoelectric conversion module electrically connected to the CPU, wherein the first photoelectric conversion module and the second photoelectric conversion module are connected to each other by at least one optical fiber.

### Claim 2 (depends on 1)

The computer data transmitting system of claim 1, wherein first photoelectric conversion module is electrically connected to the PCI-E interface by a copper wire, and the second photoelectric conversion module is electrically connected to the CPU by a copper wire.

### Claim 3 (depends on 1)

The computer data transmitting system of claim 1, wherein the first photoelectric conversion module comprises at least one photoelectric conversion unit, and each of the at least one photoelectric conversion unit comprises a photo diode and a laser diode.

### Claim 4 (depends on 3)

The computer data transmitting system of claim 3, wherein the second photoelectric conversion module comprises at least one photoelectric conversion unit, and each of the at least one photoelectric conversion unit comprises a photo diode and a laser diode.

### Claim 5 (depends on 4)

The computer data transmitting system of claim 4, wherein the photo diode of the first photoelectric conversion module is connected to the laser diode of the second photoelectric conversion module by one of the at least one optical fiber.

### Claim 6 (depends on 4)

The computer data transmitting system of claim 4, wherein the laser diode of the first photoelectric conversion module is connected to the photo diode of the second photoelectric conversion module by one of the at least one optical fiber.

### Claim 7

A motherboard, comprising:
a base board;
a Peripheral Component Interconnect Express (PCI-E) interface fixed on the base board, the PCI-E interface being connected to a Central Processing Unit (CPU) fixed on the base board;
a first photoelectric conversion module fixed on the base board;
a second photoelectric conversion module fixed on the base board, wherein the first photoelectric conversion module is electrically connected to the PCI-E interface, the second photoelectric conversion module is electrically connected to the CPU, and the first photoelectric conversion module and the second photoelectric conversion module are connected to each other by at least one optical fiber.

### Claim 8 (depends on 7)

The motherboard of claim 7, wherein first photoelectric conversion module is electrically connected to the PCI-E interface by a copper wire, and the second photoelectric conversion module is electrically connected to the CPU by a copper wire.

### Claim 9 (depends on 7)

The motherboard of claim 7, wherein the first photoelectric conversion module comprises at least one photoelectric conversion unit, and each of the at least one photoelectric conversion unit comprises a photo diode and a laser diode.

### Claim 10 (depends on 9)

The motherboard of claim 9, wherein the second photoelectric conversion module comprises at least one photoelectric conversion unit, and each of the at least one photoelectric conversion unit comprises a photo diode and a laser diode.

### Claim 11 (depends on 10)

The motherboard of claim 10, wherein the photo diode of the first photoelectric conversion module is connected to the laser diode of the second photoelectric conversion module by one of the at least one optical fiber.

### Claim 12 (depends on 10)

The motherboard of claim 10, wherein the laser diode of the first photoelectric conversion module is connected to the photo diode of the second photoelectric conversion module by one of the at least one optical fiber.