# US 2013/0158639 A1 · Implantable Electrode and Method of Making the Same

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- Number: US 2013/0158639 A1
- Document ID: US20130158639A1
- Status: Published application
- Kind: A1
- Application number: 13/713,115
- Filed: 2012-12-13
- Published: 2013-06-20
- Earliest claimed: 2008-02-29
- Assignees: NeuroNexus Technologies, Inc.
- Inventors: David S. Pellinen; Mayurachat Ning Gulari; Jamille Farraye Hetke; David J. Anderson; Daryl R. Kipke; Vetter Rio J.
- Web page: https://patentgrep.com/patent/US20130158639A1

## CPC

- A61N 1/05: for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence)
- A61B 5/24: Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61N 1/0551: {Spinal or peripheral nerve electrodes}
- H05K 1/113: {Via provided in pad; Pad over filled via}
- A61N 1/0529: {Electrodes for brain stimulation}
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)}
- H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
- H05K 2201/2072: Anchoring, i.e. one structure gripping into another
- Y10T 29/49117: Conductor or circuit manufacturing
- A61N: ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY (measurement of bioelectric currents A61B; surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body A61B18/00; anaesthetic apparatus in general A61M; incandescent lamps H01K; infrared radiators for heating H05B)
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The implantable electrode system of the preferred embodiments includes a conductor, an interconnect coupled to the conductor, an insulator that insulates the interconnect, and an anchor that is connected to both the conductor and the insulating element. The anchor is mechanically interlocked with at least one of the conductor and the insulator.

## Claims

### Claim 1

A method for attaching a plurality of layers of different materials within an implantable device, comprising the steps of:
a) providing a first layer of a first material;
b) providing a second layer of a second material;
c) providing an anchor;
d) mechanically interlocking the anchor to the first layer; and
e) chemically bonding the anchor to the second layer.

### Claim 2 (depends on 1)

The method of claim 1 wherein the anchor is of a material that creates a first bond with the second layer and the first material creates a second bond with the second layer, wherein the first bond is stronger than the second bond.

### Claim 3

A method for controlling the charge distribution of an implantable electrode, comprising the steps of
a) providing a conductor;
b) providing an interconnect;
c) coupling the interconnect, to the conductor;
d) providing an insulator that insulates the interconnect;
e) providing a non-metal anchor;
f) allowing the anchor to partially envelop the conductor and to define an opening to expose a portion of the conductor;
g) providing a current to the conductor; and
h) allowing the non-metal anchor to decrease the initial current density at the enveloped portion of the conductor wherein the resultant initial current density at the enveloped portion of the conductor is substantially similar to the initial current density at the uncovered portion of the conductor.

### Claim 4

A method for decreasing irreversible chemical reactions of an implantable electrode, comprising the steps of:
a) providing a conductor;
b) providing an interconnect;
c) coupling the interconnect to the conductor;
d) providing an insulator that insulates the interconnect;
e) providing a non-metal anchor;
f) chemically bonding the anchor to the insulator;
g) allowing the anchor to substantially envelop the perimeter of the conductor and to define an opening to expose the center portion of the conductor;
h) providing a current to the conductor; and
i) allowing the non-metal anchor to decrease the initial current density at the perimeter of the conductor wherein the resultant initial current density at the perimeter of the conductor is substantially similar to the initial current density at the center portion of the conductor.

### Claim 5

An implantable electrode system, comprising:
a) a conductor including a leg;
b) an interconnect coupled to the conductor;
c) an anchor of substantially the same material as the conductor, wherein the anchor is chemically bonded to the leg of the conductor; and
d) an insulator that includes a first layer that defines a first surface that supports the interconnect, a second layer that insulates the interconnect and defines a second surface that supports the anchor, and a third layer that partially envelops the anchor and defines an opening to expose a portion of the anchor to bond with the leg of the conductor and thereby mechanically interlocking the third layer with the anchor, and wherein the third layer defines a third surface that supports the conductor.

### Claim 6

An implantable electrode system, comprising:
a) a conductor including a leg;
b) an interconnect coupled to the conductor;
c) an anchor of substantially the same material as the conductor, wherein the anchor is chemically bonded to the leg of the conductor; and
d) an insulator that includes a first layer that defines a first surface that supports the interconnect and the anchor, and a second layer that insulates the interconnect from the anchor and partially envelops the anchor, wherein the second layer also defines an opening to expose a portion of the anchor to bond with the leg of the conductor and thereby mechanically interlocking the second layer with the anchor, and wherein the second layer defines a second surface that supports the conductor.

### Claim 7

An implantable electrode system, comprising:
a) a conductor;
b) an interconnect coupled to the conductor;
c) an insulator that includes a first layer that defines a first surface that supports the interconnect, and a second layer that insulates the interconnect and defines a second surface that supports the conductor; and
d) an anchor of substantially the same material as the insulator, wherein the anchor is chemically bonded to the insulator, and wherein the anchor partially envelops the conductor and defines an opening to expose a portion of the conductor, thereby mechanically interlocking the anchor with the conductor.

### Claim 8

An implantable electrode system, comprising:
a) a conductor that defines a conductor surface;
b) an interconnect coupled to the conductor;
c) an insulator that includes a first layer that defines a first surface that supports the interconnect and a second layer that insulates the interconnect and defines a second surface that supports the conductor; and
d) an anchor that is supported by the conductor surface and is of substantially the same material as the insulator, wherein the anchor partially envelops the conductor and defines an opening to expose a portion of the conductor.

### Claim 9

An implantable electrode, comprising:
a) an insulator layer comprising an upper insulator surface;
b) an electrically conductive interconnect layer supported directly on the upper insulator surface of the insulator layer and comprising an interconnect width extending between spaced apart first and second interconnect edges;
c) an electrically conductive plug layer supported directly on an upper interconnect surface of the interconnect layer, the plug layer comprising a plug width extending between spaced apart first and second plug edges;
d) an electrically conductive electrode layer supported directly on an upper surface of the plug layer, the electrode layer comprising an electrode width or diameter extending between spaced apart first and second electrode edges; and
e) an electrically conductive anchor layer supported on the insulator layer, the anchor layer comprising an anchor width extending between spaced apart first and second anchor edges,
f) wherein the anchor layer resides adjacent to at least one of the first and second edges of the electrode layer and is electrically connected to the electrode layer by a second plug layer with a portion of the insulator layer that contacts the first interconnect edge and the first plug edge and extends to an overlaying relationship with a portion of an upper anchor surface of the anchor layer adjacent to the second plug layer to thereby lock the anchor layer in the insulating layer.

### Claim 10 (depends on 9)

The implantable electrode of claim 9 wherein the plug width is less than the interconnect width.

### Claim 11 (depends on 9)

The implantable electrode of claim 9 wherein the electrode width is greater than both the interconnect width and the plug width.

### Claim 12

An implantable electrode, comprising:
a) an insulator layer comprising an upper insulator surface;
b) an electrically conductive interconnect layer supported directly on the upper insulator surface of the insulator layer and comprising an interconnect width extending between spaced apart first and second interconnect edges;
c) an electrically conductive plug layer supported directly on an upper interconnect surface of the interconnect layer, the plug layer comprising a plug width extending between spaced apart first and second plug edges;
d) an electrically conductive electrode layer supported directly on an upper plug surface of the plug layer, the electrode layer comprising an electrode width or diameter extending between spaced apart first and second electrode edges; and
e) an electrically conductive anchor layer supported on the insulator layer,
f) wherein the anchor layer resides adjacent to at least one of the first and second electrode edges of the electrode layer and where it is electrically connected to the electrode layer with a portion of the insulator layer that contacts the first interconnect edge and the first plug edge and extending to an insulator layer support portion supporting the anchor layer comprising an anchor portion that overlaps an outer edge of the electrode.

### Claim 13 (depends on 12)

The implantable electrode of claim 12 wherein the plug width is less than the interconnect width.

### Claim 14 (depends on 12)

The implantable electrode of claim 12 wherein the electrode width is greater than both the interconnect width and the plug width.