# US 2013/0158225 A1 · Novel silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for same

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- Number: US 2013/0158225 A1
- Document ID: US20130158225A1
- Status: Published application
- Kind: A1
- Application number: 13/583,727
- Filed: 2011-04-13
- Published: 2013-06-20
- Earliest claimed: 2010-08-09
- Assignees: Hitachi Chemical Company, Ltd.
- Inventors: Tooru Kikuchi; Toshihiko Takasaki; Katsuyuki Masuda
- Web page: https://patentgrep.com/patent/US20130158225A1

## CPC

- C08G 73/106: {containing silicon}
- C08G 69/42: Polyamides containing atoms other than carbon, hydrogen, oxygen, and nitrogen (C08G69/12, C08G69/32 take precedence)
- C08G 73/105: {with oxygen only in the diamino moiety}
- C08G 73/1075: {Partially aromatic polyimides}
- C08G 73/1078: {wholly aromatic in the diamino moiety}
- C08G 77/455: containing polyamide, polyesteramide or polyimide sequences
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

A polyimide resin including repeating units represented by formula (1): wherein R is a diamine residue or a diisocyanate residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of imide rings bonded to the norbornane rings is in exo configuration with respect to the norbornane rings, and a polyamic acid resin including repeating units represented by formula (2): wherein R is a diamine residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of amide groups and carboxyl groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings. The polyimide resin is soluble in general-purpose solvents, has a good transparency and a high molecular weight, and is excellent in mechanical properties, such as tensile strength and elongation.

## Claims

### Claim 1

A polyimide resin comprising repeating units represented by formula (1):
wherein R is a diamine residue or a diisocyanate residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of imide rings bonded to the norbornane rings is in exo configuration with respect to the norbornane rings.

### Claim 2

A polyamic acid resin comprising repeating units represented by formula (2):
wherein R is a diamine residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of amide groups and carboxyl groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings.

### Claim 3 (depends on 1)

A process for producing the polyimide resin as defined in claim 1, comprising a step of allowing a diamine or a diisocyanate to react with a tetracarboxylic dianhydride represented by formula (3):
wherein m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of acid anhydride groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings.