# US 2013/0158167 A1 · Curable epoxy resin composition and optical semiconductor device using said resin composition > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0158167 A1 - Document ID: US20130158167A1 - Status: Published application - Kind: A1 - Application number: 13/819,039 - Filed: 2011-12-13 - Published: 2013-06-20 - Earliest claimed: 2010-12-20 - Assignees: Daicel Corporation - Inventors: Hiroto Takenaka - Web page: https://patentgrep.com/patent/US20130158167A1 ## CPC - C09J 113/00: Adhesives based on rubbers containing carboxyl groups - C08G 59/24: carbocyclic - C08G 59/32: Epoxy compounds containing three or more epoxy groups - C08G 59/42: Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof - C08K 3/22: of metals - H10W 74/47: comprising organic materials, e.g. plastics or resins - C08K 2003/2227: {of aluminium} - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A curable epoxy resin composition according to the present invention is a curable epoxy resin composition which includes a rubber-particle-dispersed epoxy compound (A) including an alicyclic epoxy compound and, dispersed therein, rubber particles. The curable epoxy resin composition further includes an alumina (B); and an aliphatic polyglycidyl ether (C) having a viscosity of 8000 mPa·s or more at 25° C. The rubber particles include a polymer derived from a (meth)acrylic ester as an essential monomer component, have hydroxyl group and/or carboxyl group on a surface thereof, and have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm. The curable epoxy resin composition gives a cured product having a refractive index with a difference from the refractive index of the rubber particles of within ±0.03. ## Claims ### Claim 1 A curable epoxy resin composition comprising a rubber-particle-dispersed epoxy compound (A) including an alicyclic epoxy compound and, dispersed therein, rubber particles; wherein the curable epoxy resin composition further comprises an alumina (B); and an aliphatic polyglycidyl ether (C) having a viscosity of 8000 mPa·s or more at 25° C.; wherein the rubber particles include a polymer derived from a (meth)acrylic ester as an essential monomer component, have hydroxyl group and/or carboxyl group on a surface thereof, and have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm; and wherein the curable epoxy resin composition gives a cured product having a refractive index with a difference from a refractive index of the rubber particles of within ±0.03. ### Claim 2 (depends on 1) The curable epoxy resin composition of claim 1, further comprising a curing agent (D) and a curing accelerator (E), or further comprising a curing catalyst (F). ### Claim 3 (depends on 2) The curable epoxy resin composition of claim 2, wherein the curing agent (D) is an acid anhydride that is liquid at 25° C. ### Claim 4 (depends on 2) The curable epoxy resin composition of claim 2, wherein the curing catalyst (F) is a cationic-polymerization initiator that generates a cationic species through application of an ultraviolet ray or heat. ### Claim 5 (depends on 1) The curable epoxy resin composition of claim 1, further comprising a glycidyl ether epoxy compound having no aromatic ring (other than the aliphatic polyglycidyl ether (C)) and/or a polyol compound present as a liquid at 25° C. (other than a polyether polyol and the aliphatic polyglycidyl ether (C)). ### Claim 6 (depends on 1) The curable epoxy resin composition of claim 1, wherein the aliphatic polyglycidyl ether (C) is a sorbitol polyglycidyl ether. ### Claim 7 (depends on 1) The curable epoxy resin composition of claim 1, for sealing of an optical semiconductor. ### Claim 8 (depends on 7) An optical semiconductor device comprising an optical semiconductor element sealed with the curable epoxy resin composition of claim 7. ### Claim 9 (depends on 2) The curable epoxy resin composition of claim 2, further comprising a glycidyl ether epoxy compound having no aromatic ring (other than the aliphatic polyglycidyl ether (C)) and/or a polyol compound present as a liquid at 25° C. (other than a polyether polyol and the aliphatic polyglycidyl ether (C)). ### Claim 10 (depends on 3) The curable epoxy resin composition of claim 3, further comprising a glycidyl ether epoxy compound having no aromatic ring (other than the aliphatic polyglycidyl ether (C)) and/or a polyol compound present as a liquid at 25° C. (other than a polyether polyol and the aliphatic polyglycidyl ether (C)). ### Claim 11 (depends on 4) The curable epoxy resin composition of claim 4, further comprising a glycidyl ether epoxy compound having no aromatic ring (other than the aliphatic polyglycidyl ether (C)) and/or a polyol compound present as a liquid at 25° C. (other than a polyether polyol and the aliphatic polyglycidyl ether (C)). ### Claim 12 (depends on 2) The curable epoxy resin composition of claim 2, wherein the aliphatic polyglycidyl ether (C) is a sorbitol polyglycidyl ether. ### Claim 13 (depends on 3) The curable epoxy resin composition of claim 3, wherein the aliphatic polyglycidyl ether (C) is a sorbitol polyglycidyl ether. ### Claim 14 (depends on 4) The curable epoxy resin composition of claim 4, wherein the aliphatic polyglycidyl ether (C) is a sorbitol polyglycidyl ether. ### Claim 15 (depends on 5) The curable epoxy resin composition of claim 5, wherein the aliphatic polyglycidyl ether (C) is a sorbitol polyglycidyl ether. ### Claim 16 (depends on 2) The curable epoxy resin composition of claim 2, for sealing of an optical semiconductor. ### Claim 17 (depends on 3) The curable epoxy resin composition of claim 3, for sealing of an optical semiconductor. ### Claim 18 (depends on 4) The curable epoxy resin composition of claim 4, for sealing of an optical semiconductor. ### Claim 19 (depends on 5) The curable epoxy resin composition of claim 5, for sealing of an optical semiconductor. ### Claim 20 (depends on 6) The curable epoxy resin composition of claim 6, for sealing of an optical semiconductor.