# US 2013/0157418 A1 · Integrated circuit packaging system with interconnects and method of manufacture thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0157418 A1 - Document ID: US20130157418A1 - Status: Published application - Kind: A1 - Application number: 13/325,903 - Filed: 2011-12-14 - Published: 2013-06-20 - Earliest claimed: 2011-12-14 - Assignees: STATS ChipPAC, Ltd. - Inventors: JoonYoung Choi; YongHyuk Jeong; DaeSik Choi - Web page: https://patentgrep.com/patent/US20130157418A1 ## CPC - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 74/016: {using moulds} - H10W 90/00: Package configurations - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/635: {Through-vias} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of manufacture of an integrated circuit packaging system includes: providing a base carrier; forming a conductive post on the base carrier, the conductive post having a top protrusion with a protrusion top side; mounting a base integrated circuit over the base carrier; and forming a base encapsulation over the base integrated circuit, the base encapsulation having an encapsulation top side and an encapsulation recess with the conductive post partially exposed within the encapsulation recess, the encapsulation top side above the protrusion top side. ## Claims ### Claim 1 A method of manufacture of an integrated circuit packaging system comprising: providing a base carrier having a carrier pad; forming a conductive post on the carrier pad of the base carrier, the conductive post having a top protrusion with a protrusion top side and the conductive post for forming an electrolytic bond with the carrier pad; mounting a base integrated circuit over the base carrier; forming a base encapsulation over the base integrated circuit, the base encapsulation having an encapsulation top side and an encapsulation recess with the conductive post partially exposed within the encapsulation recess, the encapsulation recess wider near the encapsulation top side than near the conductive post, and the encapsulation top side above the protrusion top side; and forming a stack external connector completely filling and conforming to the contours of encapsulation recess and the top protrusion. ### Claim 2 (depends on 1) The method as claimed in claim 1 further comprising forming a seed layer over the base carrier. ### Claim 3 (depends on 1) The method as claimed in claim 1 wherein forming the conductive post includes forming the conductive post having a post recess at the protrusion top side. ### Claim 4 (depends on 1) The method as claimed in claim 1 wherein forming the conductive post includes forming the conductive post having a body with the top protrusion horizontally extending beyond a non-horizontal extent of the body. ### Claim 5 (depends on 1) The method as claimed in claim 1 wherein forming the conductive post includes forming the conductive post with a body having a non-horizontal extent coplanar with a non-horizontal extent of the top protrusion. ### Claim 6 A method of manufacture of an integrated circuit packaging system comprising: providing a base carrier having a carrier pad; forming a conductive post on the carrier pad of the base carrier, the conductive post having a top protrusion with a protrusion top side and the conductive post for forming an electrolytic bond with the carrier pad; mounting a base integrated circuit over the base carrier; forming a base encapsulation over the base integrated circuit, the base encapsulation having an encapsulation top side and an encapsulation recess with the protrusion top side partially exposed within the encapsulation recess, the encapsulation recess wider near the encapsulation top side than near the conductive post, and the encapsulation top side above the protrusion top side; and forming a stack external connector completely filling and conforming to the contours of encapsulation recess and the top protrusion. ### Claim 7 (depends on 6) The method as claimed in claim 6 further comprising forming a seed layer over portions of the carrier pad of the base carrier. ### Claim 8 (depends on 6) The method as claimed in claim 6 wherein forming the conductive post includes forming the conductive post having a post recess at the protrusion top side, the post recess horizontally bounded by the top protrusion. ### Claim 9 (depends on 6) The method as claimed in claim 6 wherein forming the conductive post includes forming the conductive post having a body with the top protrusion horizontally extending beyond a non-horizontal extent of the body, a horizontal width of the top protrusion greater than a horizontal width of the body. ### Claim 10 (depends on 6) The method as claimed in claim 6 wherein forming the conductive post includes forming the conductive post with a body and an interior protrusion, the body having a non-horizontal extent coplanar with a non-horizontal extent of the top protrusion, the interior protrusion having an interior protrusion top side coplanar with the top protrusion top side. ### Claim 11 An integrated circuit packaging system comprising: a base carrier having a carrier pad; a conductive post on the carrier pad of the base carrier, the conductive post having a top protrusion with a protrusion top side and the conductive post for forming an electrolytic bond with the carrier pad; a base integrated circuit over the base carrier; a base encapsulation over the base integrated circuit, the base encapsulation having an encapsulation top side and an encapsulation recess with the conductive post partially exposed within the encapsulation recess, the encapsulation recess wider near the encapsulation top side than near the conductive post, and the encapsulation top side above the protrusion top side; and a stack external connector completely filling and conforming to the contours of encapsulation recess and the top protrusion. ### Claim 12 (depends on 11) The system as claimed in claim 11 further comprising a seed layer over the base carrier. ### Claim 13 (depends on 11) The system as claimed in claim 11 wherein the conductive post includes a post recess at the protrusion top side. ### Claim 14 (depends on 11) The system as claimed in claim 11 wherein the conductive post includes a body with the top protrusion horizontally extending beyond a non-horizontal extent of the body. ### Claim 15 (depends on 11) The system as claimed in claim 11 wherein the conductive post includes a body having a non-horizontal extent coplanar with a non-horizontal extent of the top protrusion. ### Claim 16 (depends on 11) The system as claimed in claim 11 wherein the base encapsulation includes the encapsulation recess with the protrusion top side partially exposed within the encapsulation recess. ### Claim 17 (depends on 16) The system as claimed in claim 16 further comprising a seed layer over portions of the carrier pad of the base carrier. ### Claim 18 (depends on 16) The system as claimed in claim 16 wherein the conductive post includes a post recess at the protrusion top side, the post recess horizontally bounded by the top protrusion. ### Claim 19 (depends on 16) The system as claimed in claim 16 wherein the conductive post includes a body with the top protrusion horizontally extending beyond a non-horizontal extent of the body, a horizontal width of the top protrusion greater than a horizontal width of the body. ### Claim 20 (depends on 16) The system as claimed in claim 16 wherein the conductive post includes a body and an interior protrusion, the body having a non-horizontal extent coplanar with a non-horizontal extent of the top protrusion, the interior protrusion having an interior protrusion top side coplanar with the top protrusion top side.