# US 2013/0157070 A1 · Conductive film and conductive film roll

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- Number: US 2013/0157070 A1
- Document ID: US20130157070A1
- Status: Published application
- Kind: A1
- Application number: 13/716,403
- Filed: 2012-12-17
- Published: 2013-06-20
- Earliest claimed: 2011-12-20
- Assignees: Nitto Denko Corporation
- Inventors: Nozomi Fujino; Hiroyuki Takao; Kuniaki Ishibashi
- Web page: https://patentgrep.com/patent/US20130157070A1

## CPC

- H01B 7/04: Flexible cables, conductors, or cords, e.g. trailing cables
- C23C 14/024: {Deposition of sublayers, e.g. to promote adhesion of the coating (C23C14/027 takes precedence)}
- C23C 14/025: {Metallic sublayers}
- C23C 14/0641: {Nitrides (C23C14/0617 takes precedence)}
- C23C 28/322: {only coatings of metal elements only}
- C23C 28/34: {including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates}
- C23C 28/345: {with at least one oxide layer}
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)

## Abstract

A conductive film which comprises: a film substrate; a first transparent conductor layer; a first metal layer; and a nitride coated layer, the first transparent conductor layer, the first metal layer, and the nitride coated layer being laminated on one surface of the film substrate; a second transparent conductor layer; and a second metal layer, the second transparent conductor layer and the second metal layer are laminated on the other surface of the film substrate. The nitride coated layer prevents blocking of overlapped portions of the conductive film.

## Claims

### Claim 1

A conductive film comprising:
a film substrate;
a first transparent conductor layer laminated on one surface of the film substrate;
a first metal layer laminated on the first transparent conductor layer;
a nitride coated layer laminated on the first metal layer;
a second transparent conductor layer laminated on the other surface of the film substrate; and
a second metal layer laminated on the second transparent conductor layer.

### Claim 2 (depends on 1)

The conductive film according to claim 1, wherein the first and second metal layers are respectively a copper layer and the nitride coated layer contains copper nitride.

### Claim 3 (depends on 2)

The conductive film according to claim 2, wherein the nitride coated layer has a copper nitride content of 50% by weight to 100% by weight.

### Claim 4 (depends on 1)

The conductive film according to claim 1, wherein each material for forming the first and second transparent conductor layers is any one of indium tin oxide (ITO), indium zinc oxide or indium oxide-zinc composite oxide.

### Claim 5

A conductive film comprising:
a film substrate;
a first transparent conductor layer laminated on one surface of the film substrate;
a first metal layer laminated on the first transparent conductor layer;
a first nitride coated layer laminated on the first metal layer;
a second transparent conductor layer laminated on the other surface of the film substrate;
a second metal layer laminated on the second transparent conductor layer; and
a second nitride coated layer laminated on the second metal layer.

### Claim 6 (depends on 5)

The conductive film according to claim 5, wherein the first and second metal layers are respectively a copper layer and the first and second nitride coated layers respectively contain copper nitride.

### Claim 7 (depends on 6)

The conductive film according to claim 6, wherein the first nitride coated layer has a copper nitride content of 50% by weight to 100% by weight and the second nitride coated layer has a copper nitride content of 50% by weight to 100% by weight.

### Claim 8 (depends on 5)

The conductive film according to claim 5, wherein each material for forming the first and second transparent conductor layers is any one of indium tin oxide (ITO), indium zinc oxide or indium oxide-zinc composite oxide.

### Claim 9 (depends on 1)

A conductive film roll obtained by rolling up the conductive film according to claim 1.

### Claim 10 (depends on 2)

A conductive film roll obtained by rolling up the conductive film according to claim 2.

### Claim 11 (depends on 3)

A conductive film roll obtained by rolling up the conductive film according to claim 3.

### Claim 12 (depends on 4)

A conductive film roll obtained by rolling up the conductive film according to claim 4.

### Claim 13 (depends on 5)

A conductive film roll obtained by rolling up the conductive film according to claim 5.

### Claim 14 (depends on 6)

A conductive film roll obtained by rolling up the conductive film according to claim 6.

### Claim 15 (depends on 7)

A conductive film roll obtained by rolling up the conductive film according to claim 7.

### Claim 16 (depends on 8)

A conductive film roll obtained by rolling up the conductive film according to claim 8.