# US 2013/0157010 A1 · Transparent conductive film

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- Number: US 2013/0157010 A1
- Document ID: US20130157010A1
- Status: Published application
- Kind: A1
- Application number: 13/709,280
- Filed: 2012-12-10
- Published: 2013-06-20
- Earliest claimed: 2011-12-16
- Assignees: Nitto Denko Corporation
- Inventors: Katsunori Takada; Kazuhiro Ikai; Hiroki Kuramoto; Hiroyuki Takano; Naoki Tsuno
- Web page: https://patentgrep.com/patent/US20130157010A1

## CPC

- H05K 1/0298: {Multilayer circuits}
- H01B 1/08: oxides
- Y10T 428/24372: Particulate matter
- Y10T 428/24405: Polymer or resin [e.g., natural or synthetic rubber, etc.]
- Y10T 428/24421: Silicon containing
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A transparent conductive film includes a film base, a cured resin layer formed at one side of the film base, and an indium composite oxide layer laminated at a side of the cured resin layer opposite to the film base. The indium composite oxide layer has a thickness of 20 nm to 50 nm. The cured resin layer has a plurality of spherical particles and a binder resin layer which fixes the plurality of spherical particles to the film base. A difference w−d between a mode particle size w and a thickness d of the binder resin layer is greater than zero and less than or equal to 1.2 μm, where w is a mode particle size of the spherical particles and d is a thickness of the binder resin layer.

## Claims

### Claim 1

A transparent conductive film comprising:
a film base, a first cured resin layer formed at one side of the film base, and a first indium composite oxide layer laminated at a side of the first cured resin layer opposite to the film base,
wherein the first indium composite oxide layer has a thickness of 20 nm to 50 nm,
the first cured resin layer has a plurality of spherical particles and a first binder resin layer which fixes the plurality of spherical particles to the film base, and
a difference w−d between a mode particle size w and a thickness d of the first binder resin layer is greater than zero and less than or equal to 1.2 μm, where w is a mode particle size of the spherical particles and d is a thickness of the first binder resin layer.

### Claim 2 (depends on 1)

The transparent conductive film according to claim 1, wherein the difference w−d is 0.1 μm to 1.0 μm, and the mode particle size w is 0.5 μm to 3.0 μm.

### Claim 3 (depends on 2)

The transparent conductive film according to claim 2, wherein the difference w−d is 0.3 μm to 0.9 μm, and the mode particle size w is 1.0 μm to 2.0 μm.

### Claim 4 (depends on 1)

The transparent conductive film according to claim 1, wherein the first cured resin layer contains 0.1 parts by weight to 4.0 parts by weight of the plurality of spherical particles with respect to 100 parts by weight of a binder resin composing the first binder resin layer.

### Claim 5 (depends on 1)

The transparent conductive film according to claim 1, wherein the spherical particle is made of a material selected from a group consisting of an acrylic polymer, a silicone polymer, a styrene polymer and an inorganic silica.

### Claim 6 (depends on 1)

The transparent conductive film according to claim 1, wherein the first binder resin layer is made of a binder resin containing a multifunctional acrylate polymer and a polymer obtained by addition reaction of an acrylic acid to a glycidyl acrylate polymer.

### Claim 7 (depends on 1)

The transparent conductive film according to claim 1, wherein the film base has a thickness of 10 μm to 200 μm.

### Claim 8 (depends on 1)

The transparent conductive film according to claim 1, further comprising a second cured resin layer formed at another side of the film base, and a second indium composite oxide layer laminated at a side of the second cured resin layer opposite to the film base,
wherein the second cured resin layer has a plurality of spherical particles and a second binder resin layer that fixes the plurality of spherical particles to the film base.