# US 2013/0156971 A1 · Transparent conductive- and ito-replacement materials and structures > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0156971 A1 - Document ID: US20130156971A1 - Status: Published application - Kind: A1 - Application number: 13/660,932 - Filed: 2012-10-25 - Published: 2013-06-20 - Earliest claimed: 2011-10-28 - Assignees: Liquid X Printed Metals, Inc. - Inventors: Richard D. MCCULLOUGH; John Belot; Elizabeth Sefton - Web page: https://patentgrep.com/patent/US20130156971A1 ## CPC - H01B 13/00: Apparatus or processes specially adapted for manufacturing conductors or cables - C09D 11/52: Electrically conductive inks - C23C 18/06: Coating on selected surface areas, e.g. using masks - C23C 18/08: characterised by the deposition of metallic material - C23C 18/143: {Radiation by light, e.g. photolysis or pyrolysis} - H05K 1/092: {Dispersed materials, e.g. conductive pastes or inks} - H05K 3/105: {by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam} - H05K 3/1208: {Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38)} - H05K 2201/0108: Transparent - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Provided herein are methods comprising (i) depositing an ink on a surface, (ii) producing a conductive metal film by, for example, heating or irradiating or other treatment of said ink, and (iii) wherein the metal film is in the form of a repetitively patterned structure forming a grid-like network of vertex-shared polygons and polygon-like structures with a varying number of vertices. Transparent, conductive structures can be formed and serve as, for example, ITO-replacement materials and structures. ## Claims ### Claim 1 A method comprising: depositing an ink on a surface, and producing a conductive metal film by a treatment of said ink, wherein the metal film is in the form of a repetitively patterned structure forming a grid-like network of vertex-shared polygons and polygon-like structures with a varying number of vertices, and (i) wherein the ink comprises a composition comprising at least one metal complex comprising at least one metal and at least two ligands, wherein at least one first ligand is a sigma donor to the metal and volatilizes upon heating the metal complex, and at least one second ligand different from the first which also volatilizes upon heating the metal complex, wherein the metal complex is soluble in a solvent at 25° C.; or (ii) wherein the ink comprises a composition comprising at least one metal complex comprising at least one metal and at least two ligands, wherein at least one first ligand is an amino ligand, and at least one second ligand different from the first which, optionally, is a carboxylate, wherein the metal complex is soluble in a solvent at 25° C.; or (iii) wherein the ink comprises a composition comprising at least one neutral metal complex comprising at least one metal in a (I) or (II) oxidation state, and at least two ligands, wherein at least one first ligand is a neutral sigma donor to the metal and volatilizes upon heating the metal complex to a temperature below 150° C., and at least one second anionic ligand different from the first which also volatilizes upon heating the metal complex to a temperature below 150° C., wherein, optionally, the metal complex is soluble in a solvent at 25° C. ### Claim 2 (depends on 1) The method of claim 1, wherein the repetitively patterned structure is of triangular geometry, rectangular geometry, hexagonal geometry, circular geometry, or overlapping circular geometry. ### Claim at position 3 3-6. (canceled) ### Claim 7 (depends on 1) The method of claim 1, wherein the repetitively patterned structure comprises holes, and the apothem of the holes is about 100 microns to about 100,000 microns. ### Claim 8 (canceled) ### Claim 9 (depends on 1) The method of claim 1, wherein the repetitively patterned structure comprises lines, and the width of the lines is about 100 microns to about 10,000 microns. ### Claim 10 (canceled) ### Claim 11 (depends on 1) The method of claim 1, wherein the repetitively patterned structure comprises lines and the depth of the lines is about 1 micron to about 100 microns. ### Claim 12 (canceled) ### Claim 13 (depends on 1) The method of claim 1, wherein the repetitively patterned structure allows at least 80% of photons to pass through. ### Claim 14 (canceled) ### Claim 15 (depends on 1) The method of claim 1, wherein the surface is a glass substrate surface or a flexible organic substrate surface. ### Claim 16 (canceled) ### Claim 17 (depends on 1) The method of claim 1, wherein the producing step is carried out by heating or irradiating. ### Claim 18 (canceled) ### Claim 19 (depends on 1) The method of claim 1, wherein the producing step is carried out with a reducing agent or magnetic induction. ### Claim 20 (canceled) ### Claim 21 (depends on 1) The method of claim 1, wherein the metal is gold, silver, copper, or an alloy. ### Claim 22 (depends on 1) The method of claim 1, wherein the ink is substantially free of nanoparticles before deposition. ### Claim 23 (canceled) ### Claim 24 (depends on 1) The method of claim 1, wherein the depositing is carried out by inkjet printing, screen printing, microgravure, roll-to-roll, microcontact printing, or gravure. ### Claim 25 (depends on 1) The method of claim 1, wherein the producing is carried out by heating at a temperature of about 250° C. or less. ### Claim at position 23 26-27. (canceled) ### Claim 28 (depends on 1) The method of claim 1, wherein the repetitively patterned structure has a conductivity of at least 1,000 S/cm. ### Claim at position 25 29-31. (canceled) ### Claim 32 (depends on 1) The method of claim 1, wherein the repetitively patterned structure has a work function which is within 10 percent of the work function of the pure metal. ### Claim 33 (depends on 1) The method of claim 1, wherein the second ligand is a carboxylate or a thiolate. ### Claim 34 (depends on 1) The method of claim 1, further comprising incorporating the repetitively patterned structure in a device selected from the group consisting of a high impedance electrode, a waveguide or reflector, a biosensor, and a plasmonic resonator. ### Claim at position 29 35-37. (canceled) ### Claim 38 (depends on 1) The method of claim 1, wherein the repetitively patterned structure has a high surface area and is made of inert metal, and wherein the repetitively patterned structure is adapted for a flow-through heterogeneous catalyst support. ### Claim 39 A method comprising: depositing an ink on a surface to form a deposit, converting the deposit to a metal film, wherein the metal film shows a work function which is within 25 percent of the work function of the pure metal, wherein the metal film is in the form of a repetitively patterned structure, (i) wherein the ink comprises a composition comprising at least one metal complex comprising at least one metal and at least two ligands, wherein at least one first ligand is a sigma donor to the metal and volatilizes upon heating the metal complex, and at least one second ligand different from the first which also volatilizes upon heating the metal complex, wherein the metal complex is soluble in a solvent at 25° C.; or (ii) wherein the ink comprises a composition comprising at least one metal complex comprising at least one metal and at least two ligands, wherein at least one first ligand is an amino ligand, and at least one second ligand different from the first which, optionally, is a carboxylate, wherein the metal complex is soluble in a solvent at 25° C.; or (iii) wherein the ink comprises a composition comprising at least one neutral metal complex comprising at least one metal in a (I) or (II) oxidation state, and at least two ligands, wherein at least one first ligand is a neutral sigma donor to the metal and volatilizes upon heating the metal complex to a temperature below 150° C., and at least one second anionic ligand different from the first which also volatilizes upon heating the metal complex to a temperature below 150° C., wherein, optionally, the metal complex is soluble in a solvent at 25° C. ### Claim at position 32 40-58. (canceled) ### Claim 59 A method comprising: depositing at least one precursor composition on at least one substrate to form at least one deposited structure, wherein the precursor composition comprises at least two metal complexes, including at least one first metal complex comprising at least one first metal and at least one second metal complex different from the first metal complex and comprising at least one second metal different from the first metal, treating the deposited structure so that the first metal and the second metal form elemental forms of the first metal and the second metal in a treated structure, and wherein the treated structure is a metallic repetitively patterned structure comprising lines and holes. ### Claim at position 34 60-78. (canceled)