# US 2013/0156948 A1 · Substrate processing apparatus, substrate processing method and storage medium > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0156948 A1 - Document ID: US20130156948A1 - Status: Published application - Kind: A1 - Application number: 13/711,837 - Filed: 2012-12-12 - Published: 2013-06-20 - Earliest claimed: 2011-12-16 - Assignees: Tokyo Electron Limited - Inventors: Yoshifumi Amano - Web page: https://patentgrep.com/patent/US20130156948A1 ## CPC - B05C 5/02: {the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g.} from an outlet device in contact or almost in contact, with the work - G03F 7/3021: {from a wafer supported on a rotating chuck} - H10P 72/0414: {using mainly spraying means, e.g. nozzles} - G03F 7/162: {Coating on a rotating support, e.g. using a whirler or a spinner} - G03F 7/42: Stripping or agents therefor - B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08) - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A substrate processing apparatus includes substrate holding unit that holds wafer W horizontally, rotation driving unit that rotates the substrate holding unit, first chemical liquid nozzle that discharges first chemical liquid toward the peripheral portion of wafer W, second chemical liquid nozzle that discharges second chemical liquid, which is different from the first chemical liquid, toward the peripheral portion of wafer, and first nozzle driving unit and second nozzle driving unit each moves the first chemical liquid nozzle and the second chemical liquid nozzle, respectively. Each chemical liquid nozzle is moved by each nozzle driving unit between processing position disposed when a chemical liquid is discharged toward the peripheral portion of wafer W, and stand-by position disposed when the chemical liquid is not discharged. Each stand-by position is disposed in the center side of wafer W compared to the processing position. ## Claims ### Claim 1 A substrate processing apparatus comprising: a substrate holding unit configured to hold a substrate in a horizontal direction to perform a liquid processing for a peripheral portion of the substrate by a chemical liquid; a rotation driving unit configured to rotate the substrate holding unit to perform the liquid processing while rotating the substrate held by the substrate holding unit in a horizontal direction; a first chemical liquid nozzle configured to discharge a first chemical liquid toward the substrate; a second chemical liquid nozzle configured to discharge a second chemical liquid toward the substrate, the second chemical liquid being different from the first chemical liquid; a first nozzle driving unit configured to move the first chemical liquid nozzle; and a second nozzle driving unit configured to move the second chemical liquid nozzle, wherein the first nozzle driving unit moves the first chemical liquid nozzle between a first processing position where the first chemical liquid nozzle is disposed when the first chemical liquid is discharged toward the peripheral portion of the substrate and a first stand-by position where the first chemical liquid nozzle is disposed when the first chemical liquid is not discharged, the second nozzle driving unit moves the second chemical liquid nozzle between a second processing position where the second chemical liquid nozzle is disposed when the second chemical liquid is discharged toward the peripheral portion of the substrate and a second stand-by position where the second chemical liquid nozzle is disposed when the second chemical liquid is not discharged, the first stand-by position is set in the center side of the substrate compared to the second processing position, and the second stand-by position is set in the center side of the substrate compared to the first processing position. ### Claim 2 (depends on 1) The substrate processing apparatus of claim 1, wherein the first nozzle driving unit moves the first chemical liquid nozzle to the first stand-by position when the second chemical liquid nozzle is disposed in the second processing position, and the second nozzle driving unit moves the second chemical liquid nozzle to the second stand-by position when the first chemical liquid nozzle is disposed in the first processing position. ### Claim 3 (depends on 1) The substrate processing apparatus of claim 1, wherein the first chemical liquid nozzle and the second chemical liquid nozzle are configured such that the discharging directions of the first chemical liquid and the second chemical liquid to be discharged are inclined into a rotation direction of the substrate, respectively. ### Claim 4 (depends on 1) The substrate processing apparatus of claim 1, wherein the first chemical liquid nozzle and the second chemical liquid nozzle are configured such that the discharging directions of the first chemical liquid and the second chemical liquid to be discharged have a component toward the outside of the radial direction of the substrate, respectively. ### Claim 5 (depends on 1) The substrate processing apparatus of claim 1, further comprising: a first liquid receiving portion formed between the first stand-by position and the substrate and configured to receive the first chemical liquid dropped from the first chemical liquid nozzle; and a second liquid receiving portion formed between the second stand-by position and the substrate and configured to receive the second chemical liquid dropped from the second chemical liquid nozzle. ### Claim 6 (depends on 1) The substrate processing apparatus of claim 1, further comprising a rinse nozzle configured to discharge a rinse liquid toward the peripheral portion of the substrate, wherein the rinse nozzle is disposed in the center side of the substrate compared to the first chemical liquid nozzle or second chemical liquid nozzle, when the first chemical liquid nozzle or second chemical liquid nozzle discharges the chemical liquid. ### Claim 7 (depends on 1) The substrate processing apparatus of claim 1, further comprising a rinse nozzle configured to discharge a rinse liquid toward the peripheral portion of the substrate, wherein the rinse nozzle is movable between a rinse processing position where the rinse nozzle is disposed when discharging the rinse liquid toward the peripheral portion of the substrate and a rinse stand-by position where the rinse nozzle is disposed when the rinse liquid is not discharged, and the rinse stand-by position is disposed in the center side of the substrate compared to the rinse processing position. ### Claim 8 (depends on 7) The substrate processing apparatus of claim 7, wherein the first chemical liquid nozzle is moved by the first nozzle driving unit between the first processing position, the first stand-by position, and a first out-side position disposed in the outside than the first processing position where the first chemical liquid discharged from the first chemical liquid nozzle does not reach the substrate, the rinse nozzle is supported by the first nozzle driving unit to be moved along with the first chemical liquid nozzle, and the rinse nozzle is disposed in the rinse processing position when the first chemical liquid nozzle is disposed in the first out-side position. ### Claim 9 (depends on 1) The substrate processing apparatus of claim 1, further comprising a gas supplying port installed in the center side of the substrate compared to the first chemical liquid nozzle and the second chemical liquid nozzle, and configured to discharge gas toward the substrate. ### Claim 10 (depends on 1) The substrate processing apparatus of claim 1, wherein the first chemical liquid discharged from the first chemical liquid nozzle disposed in the first processing position reaches a first chemical liquid supplying position on the peripheral portion of the substrate, the second chemical liquid discharged from the second chemical liquid nozzle disposed in the second processing position reaches a second chemical liquid supplying position on the peripheral portion of the substrate, the rotation driving unit rotates the substrate holding unit in a first rotation direction when the first chemical liquid nozzle discharges the first chemical liquid, and rotates the substrate holding unit in a second rotation direction, which is opposite to the first rotation direction, when the second chemical liquid nozzle discharges the second chemical liquid. ### Claim 11 (depends on 10) The substrate processing apparatus of claim 10, wherein the central angle formed by connecting the center of the substrate, a central point of the first chemical liquid supplying position and a central point of the second chemical liquid supplying position, becomes more than 180 degrees, when the central angle is viewed along the first rotation direction with respect to the first chemical liquid supplying position as a reference. ### Claim 12 (depends on 10) The substrate processing apparatus of claim 10, further comprising a cup body including: a ring shaped liquid receiving space configured to receive the first chemical liquid and the second chemical liquid scattered from the substrate; and a drain port configured to discharge the first chemical liquid and/or the second chemical liquid, wherein a bottom surface of the cup body is constituted by a liquid receiving bottom surface which is inclined downwardly toward the drain port, the liquid receiving bottom surface has a highest position between a position corresponding to the first chemical liquid supplying position and a position corresponding to the second chemical liquid supplying position, and is inclined downwardly from the highest position along the first rotation direction and the second rotation direction. ### Claim 13 (depends on 12) The substrate processing apparatus of claim 12, wherein a carrier liquid supplying port configured to supply a carrier liquid is formed in the highest position of the liquid receiving bottom surface. ### Claim 14 A substrate processing method comprising: discharging a first chemical liquid toward the peripheral portion of a substrate by a first chemical liquid nozzle disposed in a first processing position, thereby performing a liquid processing for the peripheral portion of the substrate by the first chemical liquid while rotating the substrate held by a substrate holding unit; and discharging a second chemical liquid toward the peripheral portion of the substrate by a second chemical liquid nozzle disposed in a second processing position thereby performing the liquid processing for the peripheral portion of the substrate by the second chemical liquid while rotating the substrate held by the substrate holding unit, wherein the first chemical liquid nozzle is disposed in a first stand-by position located at the center side of the substrate compared to the first processing position, while the second chemical liquid nozzle discharges the second chemical liquid toward the substrate, and the second chemical liquid nozzle is disposed in a second stand-by position located at the center side of the substrate compared to the second processing position, while the first chemical liquid nozzle discharges the first chemical liquid toward the substrate. ### Claim 15 (depends on 14) The substrate processing method of claim 14, further comprising discharging a rinse liquid toward the peripheral portion of the substrate by a rinse nozzle disposed in a rinse processing position, wherein the rinse nozzle is disposed in a rinse stand-by position located at the center side of the substrate compared to the first processing position and the second processing position, while the first chemical liquid nozzle discharges the first chemical liquid toward the substrate and the second chemical liquid nozzle discharges the second chemical liquid toward the substrate. ### Claim 16 (depends on 15) The substrate processing method of claim 15, wherein the supplying position of the rinse liquid that is discharged from the rinse nozzle disposed in the rinse processing position and reaches the substrate is in the center side of the substrate compared to the supplying positions of the first chemical liquid and the second chemical liquid that are discharged from the first chemical liquid nozzle and the second chemical liquid nozzle and reach the substrate, and the rinse stand-by position is disposed in the center side of the substrate compared to the rinse processing position. ### Claim 17 (depends on 15) The substrate processing method of claim 15, further comprising: moving the first chemical liquid nozzle to a first out-side position disposed in the outer side than the first processing position in which the first chemical liquid discharged from the first chemical liquid nozzle does not reach the substrate; and moving the first chemical liquid nozzle from the first out-side position to the first processing position while the first chemical liquid nozzle discharges the first chemical liquid. ### Claim 18 (depends on 17) The substrate processing method of claim 17, wherein the rinse nozzle is supported by a first nozzle driving unit to be moved along with the first chemical liquid nozzle, and the rinse nozzle is disposed in the rinse processing position when the first chemical liquid nozzle is disposed in the first out-side position. ### Claim 19 (depends on 14) The substrate processing method of claim 14, wherein the first chemical liquid nozzle disposed in the first processing position discharges the first chemical liquid toward the first chemical liquid supplying position on the substrate when the substrate is rotated in a first rotation direction, and the second chemical liquid nozzle disposed in the second processing position discharges the second chemical liquid toward the second chemical liquid supplying position on the substrate when the substrate is rotated in a second rotation direction. ### Claim 20 A storage medium that stores a computer program that, when executed, causes a computer to perform a substrate processing method in a substrate processing apparatus, the substrate processing method comprising: discharging a first chemical liquid toward the peripheral portion of the substrate by a first chemical liquid nozzle disposed in a first processing position, thereby performing a liquid processing for the peripheral portion of the substrate by the first chemical liquid while rotating the substrate held by a substrate holding unit; and discharging a second chemical liquid toward the peripheral portion of the substrate by a second chemical liquid nozzle disposed in a second processing position, thereby performing the liquid processing for the peripheral portion of the substrate by the second chemical liquid while rotating the substrate held by the substrate holding unit, wherein the first chemical liquid nozzle is disposed in a first stand-by position located at the center side of the substrate compared to the first processing position, when the second chemical liquid nozzle discharges the second chemical liquid toward the substrate, and the second chemical liquid nozzle is disposed in a second stand-by position located at the center side of the substrate compared to the second processing position, when the first chemical liquid nozzle discharges the first chemical liquid toward the substrate.