# US 2013/0156937 A1 · System and Method for Aligning Sputter Sources > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0156937 A1 - Document ID: US20130156937A1 - Status: Published application - Kind: A1 - Application number: 13/328,530 - Filed: 2011-12-16 - Published: 2013-06-20 - Earliest claimed: 2011-12-16 - Assignees: Intermolecular, Inc. - Inventors: Danny Wang; Kent Riley Child; Owen Ho Yin Fong - Web page: https://patentgrep.com/patent/US20130156937A1 ## CPC - C23C 14/54: Controlling or regulating the coating process - C23C 14/3407: {Cathode assembly for sputtering apparatus, e.g. Target} - C23C 14/352: {using more than one target (C23C14/56 takes precedence)} - H01J 37/34: operating with cathodic sputtering (H01J37/36 takes precedence {; methods of cathodic sputtering C23C14/34}) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract Embodiments provided herein describe systems and methods for aligning sputtering sources, such as in a substrate processing tool. The substrate processing tool includes at least one sputtering source and a device. Each of sputtering sources includes a target having a central axis. The device has an axis and is detachably coupled to the at least one sputtering source. The device indicates to a user a direction in which the central axis of the target of the at least one sputtering source is oriented. ## Claims ### Claim 1 A substrate processing tool comprising: a plurality of sputtering sources, each of the plurality of sputtering sources comprising a target, wherein each target has a central axis perpendicular to a plane of the target; and a device having a central axis and an indicator aligned with the central axis of the device, wherein the indicator of the device is aligned with the central axis of the target of the sputtering source when the device is coupled to one of the plurality of sputtering sources. ### Claim 2 (depends on 1) The substrate processing tool of claim 1, wherein the device comprises an electromagnetic radiation source configured to emit electromagnetic radiation along the central axis of the device. ### Claim 3 (depends on 2) The substrate processing tool of claim 2, wherein the electromagnetic radiation source is a laser. ### Claim 4 (depends on 1) The substrate processing tool of claim 1, further comprising: a housing defining a processing chamber, wherein the plurality of sputtering sources are coupled to the housing and positioned within the processing chamber; and a substrate support coupled to the housing and configured to support a substrate within the processing chamber. ### Claim 5 (depends on 4) The substrate processing tool of claim 4, wherein the plurality of sputtering sources are coupled to the housing such that the respective directions in which the central axis of each of the targets are adjustable. ### Claim 6 (depends on 5) The substrate processing tool of claim 5, wherein the plurality of sputtering sources are coupled to the housing such that respective distances between each of the plurality of sputtering sources and the substrate support are adjustable. ### Claim 7 A method comprising: providing a plurality of sputtering sources positioned within a processing chamber, each of the plurality of sputtering sources comprising a target, wherein each target has a central axis perpendicular to a plane of the target; attaching a device to a first of the plurality of sputtering sources, the device having a central axis and an indicator aligned with the central axis of the device, wherein the indicator of the device is aligned with the central axis of the target of the first of the plurality of sputtering sources when the device is attached to the first of the plurality of sputtering sources; determining a direction in which the central axis of the target of the first of the plurality of sputtering sources is oriented using the device; attaching the device to a second of the plurality of sputtering sources, wherein the indicator of the device is aligned with the central axis of the target of the second of the plurality of sputtering sources when the device is attached to the second of the plurality of sputtering sources; and determining a direction in which the central axis of the target of the second of the plurality of sputtering sources is oriented using the device. ### Claim 8 (depends on 7) The method of claim 7, wherein the device comprises an electromagnetic radiation source configured to emit electromagnetic radiation along the central axis of the device. ### Claim 9 (depends on 8) The method of claim 8, wherein the electromagnetic radiation source is a laser. ### Claim 10 (depends on 7) The method of claim 7, wherein the substrate processing tool further comprises: a housing defining the processing chamber, wherein the plurality of sputtering sources are coupled to the housing; and a substrate support coupled to the housing and configured to support a substrate within the processing chamber. ### Claim 11 (depends on 10) The method of claim 10, wherein the plurality of sputtering sources are coupled to the housing such that the respective directions in which the central axis of each of the targets are adjustable and respective distances between each of the first sputtering sources and the substrate support are adjustable. ### Claim 12 (depends on 10) The method of claim 10, further comprising: moving the first of the plurality of sputtering sources relative to the housing to adjust the direction in which the central axis of the target of the first of the plurality of sputtering sources is oriented; and detaching the device from the first of the plurality of sputtering sources. ### Claim 13 (depends on 12) The method of claim 12, further comprising: attaching the device to a second of the plurality of sputtering sources moving the second of the plurality of sputtering sources relative to the housing to adjust the direction in which the central axis of the target of the second of the plurality of sputtering sources is oriented; and detaching the device from the second of the plurality of sputtering sources. ### Claim 14 (depends on 12) The method of claim 12, further comprising sputtering particles from the target of the first of the plurality of sputtering sources such that the particles are deposited on the substrate. ### Claim 15 A substrate processing tool comprising: a housing defining a processing chamber; a substrate support coupled to the housing and configured to support a substrate within the processing chamber; a plurality of sputtering sources coupled to the housing and positioned within the processing chamber above the substrate support, each of the plurality of sputtering sources comprising a target, wherein each target has a central axis perpendicular to a plane of the target; and a device having a central axis and an indicator aligned with the central axis of the device, wherein the indicator of the device is aligned with the central axis of the target of the respective sputtering source when the device is coupled to one of the plurality of sputtering sources. ### Claim 16 (depends on 15) The substrate processing tool of claim 15, wherein the device comprises an electromagnetic radiation source configured to emit electromagnetic radiation along the central axis of the device. ### Claim 17 (depends on 16) The substrate processing tool of claim 16, wherein the electromagnetic radiation source is a laser. ### Claim 18 (depends on 17) The substrate processing tool of claim 17, wherein the plurality of sputtering sources are coupled to the housing such that the respective directions in which the central axis of each of the targets are adjustable. ### Claim 19 (depends on 18) The substrate processing tool of claim 18, wherein the plurality of sputtering sources are coupled to the housing such that respective distances between each of the plurality of sputtering sources and the substrate support are adjustable. ### Claim 20 (depends on 15) The substrate processing tool of claim 15, wherein the device is configured to be detachably coupled to each of the plurality of sputtering sources.