# US 2013/0156936 A1 · Sputter gun having variable magnetic strength > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0156936 A1 - Document ID: US20130156936A1 - Status: Published application - Kind: A1 - Application number: 13/325,348 - Filed: 2011-12-14 - Published: 2013-06-20 - Earliest claimed: 2011-12-14 - Assignees: Intermolecular, Inc. - Inventors: Owen Ho Yin Fong; Kent Riley Child - Web page: https://patentgrep.com/patent/US20130156936A1 ## CPC - C23C 14/35: by application of a magnetic field, e.g. magnetron sputtering {(C23C14/3457 takes precedence)} - C23C 14/042: {using masks} - C23C 14/351: {using a magnetic field in close vicinity to the substrate} - C23C 14/352: {using more than one target (C23C14/56 takes precedence)} - C23C 14/505: {for rotation of the substrates} - C23C 14/542: {Controlling the film thickness or evaporation rate} - C23C 14/564: {Means for minimising impurities in the coating chamber such as dust, moisture, residual gases} - H01J 37/34: operating with cathodic sputtering (H01J37/36 takes precedence {; methods of cathodic sputtering C23C14/34}) - H01J 37/3402: {using supplementary magnetic fields} - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract A sputter source is provided. The sputter source includes a shaft extending through a central region of the sputter source. A first end of the shaft is coupled to a drive and a second end of the shaft is coupled to a bottom plate. A first plate having a ramped surface is included where the first plate is stationary. A second plate having a ramped surface is provided where the second plate is disposed above the first plate such that portions of the ramped surfaces contact each other. The second plate is coupled to the shaft, wherein the second plate is operable to rotate and move axially as the shaft rotates in a first direction and wherein the second plate is operable to remain stationary as the shaft rotates in a second direction. ## Claims ### Claim 1 A sputter source, comprising: a shaft extending through a central region of the sputter source, a first end of the shaft coupled to a drive and a second end of the shaft coupled to a bottom plate; a first plate disposed around the shaft and having an inclined surface, and wherein the first plate remains stationary when the shaft is rotated; a second plate disposed around the shaft and coupled to the shaft, the second plate having an inclined surface, wherein portions of the inclined surface of the first plate and portions of the inclined surface of the second plate contact each other; and wherein the second plate is operable to rotate as the shaft rotates in a first direction and wherein the second plate is operable to remain stationary as the shaft rotates in a second direction. ### Claim 2 (depends on 1) The sputter source of claim 1, wherein as the shaft rotates in the first direction, the second plate moves one of vertically towards or vertically away from a bottom surface of the first plate. ### Claim 3 (depends on 1) The sputter source of claim 1, wherein the second plate is coupled to the shaft through a one way bearing. ### Claim 4 (depends on 1) The sputter source of claim 1, wherein the second plate is coupled to the shaft through a ratchet. ### Claim 5 (depends on 1) The sputter source of claim 1, wherein the second plate is coupled to a housing and the housing is coupled to the shaft through a one way bearing. ### Claim 6 (depends on 5) The sputter source of claim 5, further comprising: a sensor operable to sense a distance from the sensor to the housing, wherein a change of the distance from the sensor to the housing triggers rotation of the shaft in the first direction. ### Claim 7 (depends on 1) The sputter source of claim 1, wherein a plurality of magnets are coupled to a bottom surface of the first plate. ### Claim 8 (depends on 1) The sputter source of claim 1, wherein the first plate comprises an electrically insulative material. ### Claim 9 A sputter source, comprising: a shaft extending through a central region of the sputter source, the shaft having an axis, a first end of the shaft coupled to a drive and a second end of the shaft coupled to a bottom plate, the bottom plate disposed around the shaft, wherein the shaft is operable to rotate a plurality of magnets coupled to the bottom plate, the plurality of magnets rotate in either a first direction of rotation of the shaft or the second direction of rotation of the shaft, and wherein the shaft is operable to move the plurality of magnets along the axis during rotation in one of the first direction or the second direction. ### Claim 10 (depends on 9) The sputter source of claim 9, further comprising a stationary plate disposed around the shaft and coupled to the shaft; a rotatable plate disposed over the stationary plate, the rotatable plate coupled to the shaft so that the rotatable plate rotates in only one of the first direction or the second direction, and wherein rotation of the rotatable plate triggers axial movement of the plurality of magnets. ### Claim 11 (depends on 10) The sputter source of claim 10, wherein a spring forces the rotatable plate against the stationary plate. ### Claim 12 (depends on 10) The sputter source of claim 10, wherein the rotatable plate contacts the stationary plate along at least one radial support point. ### Claim 13 (depends on 10) The sputter source of claim 10, wherein the rotatable plate is coupled to a housing and the housing is coupled to the shaft through a first one way bearing, and wherein the housing includes a second one way bearing operable to prevent the housing from back-driving. ### Claim 14 (depends on 9) The sputter source of claim 9, further comprising: a target affixed to a backing plate disposed below the plurality of magnets. ### Claim 15 (depends on 10) The sputter source of claim 10, further comprising: a sensor operable to sense a distance from the sensor to a surface of a housing coupling the rotatable plate to the shaft. ### Claim 16 A method of processing a substrate, comprising; depositing a layer of material onto the substrate through a physical vapor deposition process; during the depositing, the method includes, identifying a rate of erosion of a source of the layer of material; and changing a direction of rotation of a shaft operable to rotate a plurality of magnets disposed above the source, the reversing causing movement of the plurality of magnets along an axis of the shaft. ### Claim 17 (depends on 16) The method of claim 16, further comprising: sensing an amount of axial movement of the plurality of magnets; and terminating the axial movement of the plurality of magnets upon obtaining a desired amount of axial movement. ### Claim 18 (depends on 16) The method of claim 16, wherein the identifying includes accessing a lookup table based on a composition of the source. ### Claim 19 (depends on 16) The method of claim 16 wherein the reversing is based on an amount of time for the depositing. ### Claim 20 (depends on 17) The method of claim 17, wherein the terminating is triggered by another changing of the direction of rotation of the shaft.