# US 2013/0156616 A1 · Thin fan and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0156616 A1 - Document ID: US20130156616A1 - Status: Published application - Kind: A1 - Application number: 13/447,841 - Filed: 2012-04-16 - Published: 2013-06-20 - Earliest claimed: 2011-12-19 - Assignees: Delta Electronics, Inc. - Inventors: Chia-Yuan CHANG; Han-Pei Wang; Cheng-Chieh Liu; Wen-Ping Teng - Web page: https://patentgrep.com/patent/US20130156616A1 ## CPC - F04D 29/624: {especially adapted for elastic fluid pumps} - F04D 25/0606: {the electric motor being specially adapted for integration in the pump} - F04D 25/0633: {Details of the magnetic circuit} - F04D 25/0693: {Details or arrangements of the wiring} - F04D 29/424: {Double entry casings} - H05K 3/182: {characterised by the patterning method} - H05K 3/341: Surface mounted components - F04D 29/646: {Mounting or removal of fans} - H05K 3/105: {by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam} - H05K 2201/0215: Metallic fillers - H05K 2201/0999: Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - Y10T 29/49316: Impeller making - F04D: NON-POSITIVE-DISPLACEMENT PUMPS (engine fuel-injection pumps F02M; ion pumps H01J41/12; electrodynamic pumps H02K44/02) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A manufacturing method of a thin fan comprises the steps of: providing a plastic material containing a plurality of metal particles; molding the plastic material into a housing; removing a part of a surface of the housing to form a circuit layout area at the housing; and forming a metal layer in the circuit layout area. ## Claims ### Claim 1 A manufacturing method of a thin fan, comprising the steps of: providing a plastic material containing a plurality of metal particles; molding the plastic material into a housing; removing a part of a surface of the housing to form a circuit layout area at the housing; and forming a metal layer in the circuit layout area. ### Claim 2 (depends on 1) The manufacturing method of claim 1, wherein the plastic material comprises polyphthalamide (PPA) and/or liquid crystalline polymer (LCP), and the metal particles comprise copper particles and/or chromium particles. ### Claim 3 (depends on 1) The manufacturing method of claim 1, wherein the step of removing a part of a surface of the housing comprises roughening the surface so as to expose the metal particles therein. ### Claim 4 (depends on 1) The manufacturing method of claim 1, wherein the step of removing a part of a surface of the housing comprises illuminating the surface by laser. ### Claim 5 (depends on 1) The manufacturing method of claim 1, wherein the step of forming a metal layer in the circuit layout area comprises forming the metal layer by chemical plating. ### Claim 6 (depends on 1) The manufacturing method of claim 1, further comprising: disposing at least one electronic device on the metal layer; and assembling the housing, a stator, and an impeller. ### Claim 7 (depends on 1) The manufacturing method of claim 1, wherein the step of disposing at least one electronic device on the metal layer comprises disposing the electronic device on the metal layer by soldering. ### Claim 8 A thin fan comprising: a housing comprising: a circuit layout area having a plurality of metal particles, wherein some of the metal particles are exposed to the circuit layout area; and a metal layer disposed in the circuit layout area and connected with the exposed metal particles; a stator disposed to the housing; and an impeller covered by the housing; wherein there is no further circuit board disposed in the housing. ### Claim 9 (depends on 8) The thin fan of claim 8, wherein the metal particles comprise copper particles and/or chromium particles. ### Claim 10 (depends on 8) The thin fan of claim 8, wherein the housing further comprises at least one electronic device disposed on the metal layer. ### Claim 11 (depends on 8) The thin fan of claim 8, further comprising: a bearing connected to the impeller; and a rotor disposed to the impeller and disposed corresponding to the stator. ### Claim 12 (depends on 8) The thin fan of claim 8, wherein the housing is formed by at least one plastic material, and the plastic material comprises polyphthalamide (PPA) and/or liquid crystalline polymer (LCP). ### Claim 13 (depends on 8) The thin fan of claim 8, wherein the housing comprises a circuit layout portion with the circuit layout portion thereon and a housing portion connected to the circuit layout portion. ### Claim 14 (depends on 13) The thin fan of claim 13, wherein the circuit layout portion contains metal particles, and the housing portion doesn't contain metal particles. ### Claim 15 (depends on 8) The thin fan of claim 8, wherein the housing is formed by injection molding or cast molding. ### Claim 16 (depends on 8) The thin fan of claim 8, wherein the housing further comprises a plurality of electronic devices which are disposed on the metal layer and coupled or electrically connected to each other through the metal layer. ### Claim 17 A manufacturing method of a thin fan, comprising steps of: providing a first plastic material containing a plurality of metal particles; molding the first plastic material into a circuit layout portion; providing a second plastic material without metal particles; molding the second plastic material into a housing portion connected to the circuit layout portion to form a housing; removing a part of a surface of the circuit layout portion to form a circuit layout area; and forming a metal layer in the circuit layout area. ### Claim 18 (depends on 17) The manufacturing method of claim 17, wherein the step of removing a part of a surface of the circuit layout portion comprises roughening the surface so as to expose the metal particles therein. ### Claim 19 (depends on 17) The manufacturing method of claim 17, wherein the step of forming a metal layer in the circuit layout area comprises forming the metal layer by chemical plating. ### Claim 20 (depends on 17) The manufacturing method of claim 17, further comprising: disposing at least one electronic device on the metal layer.