# US 2013/0156530 A1 · Method and apparatus for reducing contamination of substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0156530 A1 - Document ID: US20130156530A1 - Status: Published application - Kind: A1 - Application number: 13/325,232 - Filed: 2011-12-14 - Published: 2013-06-20 - Earliest claimed: 2011-12-14 - Assignees: Intermolecular, Inc. - Inventors: Robert Sculac; Aaron Francis; Satbir Kahlon; Le Marious Sword - Web page: https://patentgrep.com/patent/US20130156530A1 ## CPC - B25J 9/0012: {making use of synthetic construction materials, e.g. plastics, composites} - B25J 19/0075: {Means for protecting the manipulator from its environment or vice versa} - H10P 72/3302: {Mechanical parts of transfer devices} - H10P 72/7616: {characterised by a coating, a hardness or a material} - B25J: MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES ({manipulators specially adapted for use in surgery A61B34/70; manipulators used in cleaning hollow articles B08B9/04}; manipulators associated with rolling mills B21B39/20; manipulators associated with forging machines B21J13/10; {manipulators associated with picking-up and placing mechanisms B23P19/007}; means for holding wheels or parts thereof B60B30/00; {vehicles with ground-engaging propulsion means, e.g. walking members B62D57/02, B62D57/032; devices for picking-up and depositing articles or materials between conveyors B65G47/90, B65G47/91; manipulators with gripping or holding means for transferring packages B65H67/065}; cranes B66C; {manipulators used in the protection or supervision of pipe-line installations F17D5/00; walking equipment adapted for nuclear steam-generators F22B37/006}; manipulators specially adapted for, or associated with, nuclear reactors G21C; {apparatus used for handling wafers during manufacture or treatment of semiconductor H10P72/50}) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract An aligner, chuck, and end effector for substrate processing are provided. The aligner includes a rotatable substrate support having a surface for supporting the substrate. The rotatable substrate support has a diameter less than a diameter of the substrate and surfaces of the rotatable substrate support are coated with a coating consisting essentially of a poly(p-xylylene) polymer. The chuck includes a flat platform that supports the substrate during processing. The chuck is larger than the substrate and may include holes though which lift pins can pass assist the loading/unloading of the substrate. The end effector includes an arm supporting a first extension and a second extension, wherein the arm, the first extension and the second extension are coated with a coating consisting essentially of a poly(p-xylylene) polymer. ## Claims ### Claim 1 An aligner for semiconductor substrate processing, comprising: a rotatable substrate support having a surface for supporting a semiconductor substrate, wherein the rotatable substrate support is coated with a coating consisting essentially of a poly(p-xylylene) polymer. ### Claim 2 (depends on 1) The aligner of claim 1, wherein the aligner is moveable in a vertical direction. ### Claim 3 (depends on 1) The aligner of claim 1, wherein the aligner is configured to receive the semiconductor substrate from an end effector, and wherein surfaces of the end effector contacting the substrate are coated with the coating consisting essentially of the poly(p-xylylene) polymer. ### Claim 4 (depends on 1) The aligner of claim 1, wherein the aligner includes a plurality of moveable pins disposed around an outer edge of the rotatable substrate support. ### Claim 5 (depends on 1) The aligner of claim 1, wherein each of the plurality of moveable pins is coated with the coating consisting essentially of the poly(p-xylylene) polymer. ### Claim 6 (depends on 1) The aligner of claim 1, wherein the aligner is integrated into a combinatorial processing system having a wet processing module, a spin rinse and dry module, and an end effector operable to transport the semiconductor substrate between the aligner, the wet processing module and the spin rinse and dry module. ### Claim 7 (depends on 6) The aligner of claim 6, wherein the wet processing module is configured to contemporaneously process different regions of the semiconductor substrate in a combinatorial manner. ### Claim 8 (depends on 1) The aligner of claim 1, wherein the aligner is integrated into a semiconductor processing tool having a plurality of processing modules, the semiconductor processing tool having an end effector operable to transport the semiconductor substrate between the plurality of processing modules. ### Claim 9 An end effector for transporting a semiconductor substrate, comprising: an arm supporting a first extension and a second extension, wherein the arm, the first extension, and the second extension are coated with a coating consisting essentially of a poly(p-xylylene) polymer. ### Claim 10 (depends on 9) The end effector of claim 9, wherein the end effector is composed of aluminum. ### Claim 11 (depends on 9) The end effector of claim 9, wherein the end effector is composed of a ceramic material. ### Claim 12 (depends on 9) The end effector of claim 9, wherein the end effector is integrated into a combinatorial processing system having a wet processing module, a spin rinse and dry module, and the end effector is operable to transport the semiconductor substrate between the aligner, the wet processing module, and the spin rinse and dry module. ### Claim 13 (depends on 12) The end effector of claim 12, wherein the semiconductor substrate has a plurality of regions, each of the plurality of regions processed in a combinatorial manner within the wet processing module. ### Claim 14 (depends on 9) The end effector of claim 9 wherein the end effector is integrated into a semiconductor processing tool having a plurality of processing modules, the end effector operable to transport the semiconductor substrate between the plurality of processing modules.