# US 2013/0156394 A1 · Optical communication module and method of manufacturing the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2013/0156394 A1
- Document ID: US20130156394A1
- Status: Published application
- Kind: A1
- Application number: 13/611,119
- Filed: 2012-09-12
- Published: 2013-06-20
- Earliest claimed: 2011-12-20
- Assignees: Electronics and Telecommunications Research Institute
- Inventors: Joong-Seon CHOE; Jong-Hoi Kim; Kwang-Seong Choi; Chun Ju Youn; Duk Jun Kim; Yong-Hwan Kwon; Eun Soo Nam
- Web page: https://patentgrep.com/patent/US20130156394A1

## CPC

- G02B 6/4267: {Reduction of thermal stress, e.g. by selecting thermal coefficient of materials}
- G02B 6/4239: {Adhesive bonding; Encapsulation with polymer material}
- G02B 6/4245: {Mounting of the opto-electronic elements}
- G02B 6/4272: {with mounting substrates of high thermal conductivity}
- Y10T 156/10: Methods of surface bonding and/or assembly therefor
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The inventive concept relates to an optical communication module. The optical communication module may include a metal block: an electrical device formed on the metal block; an optical device adhesive block formed on the metal block; an optical device formed on the optical device adhesive block and connected to the electrical device through a bonding interconnection; and a flat type optical waveguide formed on one side of the optical device adhesive block and optically aligned with the optical device.

## Claims

### Claim 1

An optical communication module comprising:
a metal block:
an electrical device formed on the metal block;
an optical device adhesive block formed on the metal block;
an optical device formed on the optical device adhesive block and connected to the electrical device through a bonding interconnection; and
a flat type optical waveguide formed on one side of the optical device adhesive block and optically aligned with the optical device.

### Claim 2 (depends on 1)

The optical communication module of claim 1, wherein the flat type optical wave guide adheres to one side of the optical device adhesive block.

### Claim 3 (depends on 2)

The optical communication module of claim 2, wherein the flat type optical waveguide adheres to one side of the optical device adhesive block using an ultraviolet hardening epoxy.

### Claim 4 (depends on 1)

The optical communication module of claim 1, wherein the optical device adhesive block comprises a material having a thermal expansion coefficient having a difference within a reference value with respect to a thermal expansion coefficient of the flat type optical waveguide.

### Claim 5 (depends on 1)

The optical communication module of claim 1, wherein the optical device adhesive block comprises the same material as the flat type optical waveguide.

### Claim 6 (depends on 1)

The optical communication module of claim 1, wherein the optical device adheres to the optical device adhesive block using a first conductive material and the electrical device adheres to the metal block using a second conductive material.

### Claim 7 (depends on 6)

The optical communication module of claim 6, wherein the first conductive material and the second conductive material are connected to each other.

### Claim 8 (depends on 6)

The optical communication module of claim 6, wherein the first conductive material is connected to the metal block through an interconnection.

### Claim 9 (depends on 6)

The optical communication module of claim 6, wherein each of the first conductive material and the second conductive material comprises a silver epoxy.

### Claim 10 (depends on 6)

The optical communication module of claim 6, further comprising a metal plate formed on the optical device adhesive block, wherein the optical device adheres onto the metal plate using the first conductive material and the metal plate is connected to the metal block through an interconnection.

### Claim 11 (depends on 1)

The optical communication module of claim 1, wherein the optical device comprises a waveguide type optical device and a waveguide of the optical device is optically aligned with the flat type optical waveguide.

### Claim 12 (depends on 1)

The optical communication module of claim 1, wherein the metal block has a stair structure including a first top surface and a second top surface lower than the first top surface,
wherein the electrical device is formed on the first top surface of the metal block, and
wherein the optical device adhesive block is formed on the second top surface of the metal block.

### Claim 13 (depends on 12)

The optical communication module of claim 12, wherein the first top surface of the metal block and a top surface of the optical device adhesive block are aligned with each other.

### Claim 14

A method of manufacturing an optical communication module comprising:
forming a metal block having a stair structure including a first top surface and a second top surface lower than the first top surface;
forming an optical device adhesive block on the second top surface of the metal block;
attaching an electrical device on the first top surface of the metal block;
attaching a waveguide type optical device on the top surface of the optical device adhesive block;
connecting the electrical device and the waveguide type optical device to each other using a bonding interconnection; and
attaching a flat type optical waveguide on one side of the optical device adhesive block,
wherein the flat type optical waveguide is optically aligned with a waveguide of the waveguide type optical device.