# US 2013/0156235 A1 · Acoustic Apparatus And Method Of Manufacturing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0156235 A1 - Document ID: US20130156235A1 - Status: Published application - Kind: A1 - Application number: 13/571,566 - Filed: 2012-08-10 - Published: 2013-06-20 - Earliest claimed: 2011-08-19 - Assignees: Knowles Electronics, LLC - Inventors: Timothy K. Wickstrom - Web page: https://patentgrep.com/patent/US20130156235A1 ## CPC - H04R 19/04: Microphones (H04R19/01 takes precedence) - H04R 1/2853: {using an acoustic labyrinth or a transmission line} - H04R 31/00: Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} - H04R 1/227: {using transducers reproducing the same frequency band} - H04R 2201/003: Mems transducers or their use - H04R 2499/11: Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) ## Abstract A microphone assembly comprising includes a base, at least one side wall, and a cover. The side wall is disposed on the base. The cover is coupled to the at least one side wall. The base, the side wall, and the cover form a cavity and the cavity has a MEMS device disposed therein. A top port extends through the cover and a first channel extends through the side wall. The first channel is arranged so as to communicate with the top port. A bottom port extends through the base. The MEMS device is disposed over the bottom port. A second channel is formed and extends along a bottom surface of the base. The second channel extends between and communicates with the first channel and the bottom port. Sound received by the top port is received at the MEMS device. ## Claims ### Claim 1 A microphone assembly comprising: a base; at least one side wall disposed on the base; a cover coupled to the at least one side wall, wherein the base, the at least one side wall, and the cover form a cavity, the cavity having a MEMS device disposed therein; a top port extending through the cover; a first channel extending through the at least one side wall, the first channel arranged so as to communicate with the top port; a bottom port extending through the base, wherein the MEMS device is disposed over the bottom port; a second channel formed and extending along a bottom surface of the base, the second channel extending between and communicating with the first channel and the bottom port; such that sound energy received by the top port passes through the first channel, the second channel, and the bottom port and is received at the MEMS device. ### Claim 2 (depends on 1) The microphone assembly of claim 1 wherein a solder ring, the bottom surface of the base, and a mounting substrate form the second channel. ### Claim 3 (depends on 1) The microphone assembly of claim 1 wherein the base comprises a printed circuit board. ### Claim 4 (depends on 1) The microphone assembly of claim 1 further comprising an integrated circuit disposed in the cavity and coupled to the MEMS device. ### Claim 5 (depends on 1) The microphone assembly of claim 1 wherein the MEMS device defines a front volume and a back volume and the back volume is significantly larger than the front volume. ### Claim 6 A multiple microphone assembly comprising: a base; at least one side wall disposed on the base; a cover coupled to the at least one side wall, wherein the base, the at least one wall, and the cover form a cavity, the cavity having a first MEMS device and a second MEMS device disposed therein; a top port extending through the cover; a first channel extending through the at least one side wall, the first channel arranged so as to communicate with the top port; a first bottom port extending through the base, wherein the first MEMS device is disposed over the first bottom port; a second channel formed and extending along a bottom surface of the base, the second channel extending between and communicating with the first channel and the first bottom port; a second bottom port extending through the base, wherein the second MEMS device is disposed over the second bottom port; a third channel formed and extending along the bottom surface of the base, the third channel extending between and communicating with a fourth channel in a substrate and the second bottom port; such that first sound energy received by the top port passes through the first channel, the second channel, and the bottom port and is received at the first MEMS device; and such that second sound energy received from the fourth channel in the substrate passes through the third channel and the second bottom port and is received at the second MEMS device. ### Claim 7 (depends on 6) The multiple microphone assembly of claim 6 wherein the first MEMS device and the second MEMS device share a single back volume. ### Claim 8 (depends on 6) The multiple microphone assembly of claim 6 further comprising an interior wall, the interior wall partitioning the cavity into a first sub-cavity and a second sub-cavity. ### Claim 9 (depends on 8) The multiple microphone assembly of claim 8 wherein the first MEMS device is disposed in the first sub-cavity and the second MEMS device is disposed in the second sub-cavity. ### Claim 10 (depends on 9) The multiple microphone assembly of claim 9 wherein the first MEMS device utilizes a first back volume and the second MEMS device utilizes a second back volume, and the first back volume is separated from the second back volume by the interior wall. ### Claim 11 (depends on 6) The multiple microphone assembly of claim 6 further comprising a solder ring disposed on the bottom surface of the base, the solder ring, the bottom surface of the base, and a mounting substrate forming the second channel. ### Claim 12 (depends on 6) The multiple microphone assembly of claim 6 wherein the base comprises a printed circuit board. ### Claim 13 (depends on 6) The multiple microphone assembly of claim 6 further comprising an integrated circuit disposed in the cavity and coupled to the first MEMS device or the second MEMS device. ### Claim 14 (depends on 6) The multiple microphone assembly of claim 6: wherein the first MEMS device and the second MEMS device form at least one front volume; wherein the first MEMS device and the base form a first front volume; wherein the second MEMS device and the base form a second front volume; and wherein the at least one back volume is significantly larger than the first front volume or the second front volume.