# US 2013/0156058 A1 · Light emitting device, and method for manufacturing the same

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- Number: US 2013/0156058 A1
- Document ID: US20130156058A1
- Status: Published application
- Kind: A1
- Application number: 13/820,372
- Filed: 2011-09-01
- Published: 2013-06-20
- Earliest claimed: 2010-09-03
- Assignees: Nichia Corporation
- Inventors: Ryohei Yamashita
- Web page: https://patentgrep.com/patent/US20130156058A1

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H01S 5/0232: Lead-frames
- H10H 20/8506: {Containers}
- H10W 72/0198: {batch processes}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A light emitting device includes a substantially cuboid package made up of a molded article and a lead that is embedded in the molded article, and a light emitting element that is installed in the package. The lead has a connector where the light emitting element is installed, and a terminal part and an exposed part that are linked to the connector. The package has a bottom face, a front face that is a light emission face contiguous with the bottom face, and a rear face that is contiguous with the bottom face and is opposite the front face. The first terminal part and the exposed part are linked to the rear face side of the connector are exposed from the molded article and contiguous with the bottom face and the rear face, and are isolated at the bottom face.

## Claims

### Claim 1

A light emitting device, comprising:
a package constituted by a molded article and a lead, the lead being embedded in the molded article, the package formed in a substantially cuboid shape; and
a light emitting element installed in the package,
the lead has a connector, a terminal part and an exposed part, the light emitting element mounted on the connector, the terminal part and the exposed part linked to the connector,
the package having a bottom face, a light emission face contiguous with the bottom face, and a rear face contiguous with the bottom face, the rear face being opposite the light emission face, and
the terminal part and the exposed part linked to a rear face side of the connector, the terminal part and the exposed part continuously exposed from the molded article at the bottom face and rear face, the terminal part and the exposed part being apart from each other at the bottom face.

### Claim 2 (depends on 1)

The light emitting device according to claim 1, wherein
the package has an opening formed in the light emission face, and sealing resin that fills the opening, and
the connector is exposed in an interior of the opening.

### Claim 3 (depends on 1)

The light emitting device according to claim 1, wherein
the lead has an extension that is linked to the connector and the terminal part and is exposed from the molded article at the rear face.

### Claim 4

A light emitting device, comprising:
a package constituted by a molded article and a lead, the lead being embedded in the molded article, the package formed in a substantially cuboid shape; and
a light emitting element installed in the package,
the lead has a connector and an exposed part, the light emitting element mounted on the connector, the exposed part linked to the connector,
the package having a bottom face, a light emission face contiguous with the bottom face, and a rear face contiguous with the bottom face, the rear face being opposite the light emission face, and
the terminal part and the exposed part linked to a rear face side of the connector, the terminal part and the exposed part continuously exposed from the molded article at the bottom face and rear face, the terminal part and the exposed part being apart from each other at a bottom face side of the rear face.

### Claim 5

A package array for a light emitting device, comprising:
a molded board made of resin; and
a lead frame embedded in the molded board, the lead frame formed in a thin plate shape, the lead frame having a first frame component and a second frame component adjacent to the first frame component in a specific direction,
the first frame component and the second frame component each including:
a first thick part exposed from the molded board with a first thickness;
a second thick part exposed from the molded board with the first thickness, the second thick part separated from the first thick part in the specific direction;
a first thin part linked to the first thick part and the second thick part with a second thickness less than the first thickness;
a second thin part linked to the second thick part with the second thickness, the second thin part separated from the first thin part in the specific direction; and
the second thick-walled part includes a concavity that is exposed from the molded board with the second thickness and.

### Claim 6 (depends on 5)

The package array for a light emitting device according to claim 5, wherein
the lead frame has a third frame component and a fourth frame component that have the same configuration as the first frame component and second frame component,
the third frame component and the fourth frame component are disposed in rotational symmetry to the first frame component and the second frame component around an axis parallel to a thickness direction,
the first thick part of the third frame component is linked to the first thick part of the first frame component,
the second thick part of the third frame component is linked to the second thick part of the second frame component, and
the second thick part of the fourth frame component is linked to the second thick part of the first frame component.

### Claim 7 (depends on 5)

The package array for a light emitting device according to claim 5, wherein
the lead frame has a third frame component and a fourth frame component that have the same configuration as the first frame component and second frame component,
the third frame component is adjacent to the first frame component in a perpendicular direction perpendicular to the specific direction,
the fourth frame component is adjacent to the second frame component in the perpendicular direction,
the first thick part of the third frame component is linked to the first thick part of the first frame component,
the second thick part of the third frame component is linked to the second thick part of the first frame component,
the first thin part of the fourth frame component is linked to the first thick part of the second frame component, and
the second thin part of the fourth frame component is linked to the second thick part of the second frame component.

### Claim 8

A method for manufacturing a package array for a light emitting device, comprising:
a double-sided etching step of forming etching holes in a thin metal plate by etching a first main face and a second main face opposite to the first main face of the thin metal plate;
a one-sided etching step of forming a lead frame in a specific shape by forming an etching concave component in a second pattern on the first main face, the etching concave component is formed by etching part of the first main face of the thin metal plate; and
a molding step of forming a molded board in which the lead frame is embedded by injecting resin into a metal mold in which the lead frame is disposed, wherein the lead frame has a thick part that constitutes an exposed part linked to a mounting part for mounting a light emitting element, and a thin part that constitutes a connected part separated from the mounting part with the etching holes in between.