# US 2013/0155696 A1 · Optoelectronic component and method for the production thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0155696 A1 - Document ID: US20130155696A1 - Status: Published application - Kind: A1 - Application number: 13/634,692 - Filed: 2011-03-07 - Published: 2013-06-20 - Earliest claimed: 2010-03-15 - Assignees: OSRAM Opto Semiconductors GmbH - Inventors: Gertrud Kräuter - Web page: https://patentgrep.com/patent/US20130155696A1 ## CPC - F21V 29/15: Thermal insulation - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10W 76/17: characterised by their materials - H10H 20/036: {of packages} - H10H 20/8506: {Containers} - Y10T 29/49002: Electrical device making - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An optoelectronic component includes a housing which includes a first partial region having a first thermoplastic material crosslinked by irradiation and a second partial region having a second thermoplastic material, a recess in the housing, and a radiation-emitting device disposed in the recess. ## Claims ### Claim at position 1 -15. (canceled) ### Claim 16 An optoelectronic component comprising: a housing which comprises a first partial region having a first thermoplastic material crosslinked by irradiation and a second partial region having a second thermoplastic material; a recess in the housing; and a radiation-emitting device disposed in the recess. ### Claim 17 (depends on 16) The optoelectronic component as claimed in claim 16, wherein the first thermoplastic material is different from the second thermoplastic material. ### Claim 18 (depends on 16) The optoelectronic component as claimed in claim 16, wherein the first thermoplastic material has a higher thermal stability than the second thermoplastic material. ### Claim 19 (depends on 16) The optoelectronic component as claimed in claim 16, wherein after crosslinking, the first thermoplastic material has a thermal stability up to a temperature of at least 275° C. ### Claim 20 (depends on 16) The optoelectronic component as claimed in claim 16, wherein the first partial region is formed as a housing base body. ### Claim 21 (depends on 16) The optoelectronic component as claimed in claim 16, wherein the first thermoplastic material contains a crosslinking additive. ### Claim 22 (depends on 21) The optoelectronic component as claimed in claim 21, wherein the crosslinking additive is at least one selected from the group consisting of triallyl isocyanate, trimethylolpropane triacrylate and pentaerythriol triacrylate. ### Claim 23 (depends on 16) The optoelectronic component as claimed in claim 16, wherein the second partial region is disposed on the first partial region. ### Claim 24 (depends on 16) The optoelectronic component as claimed in claim 16, wherein the second partial region is formed as a reflector. ### Claim 25 (depends on 16) The optoelectronic component as claimed claim 16, wherein the second thermoplastic material has a higher degree of reflectivity with respect to the radiation emitted by the radiation-emitting device, than the first thermoplastic material. ### Claim 26 (depends on 16) The optoelectronic component as claimed in claim 16, wherein the second thermoplastic material is at least one selected from the group consisting of polyamide, polybutylene terephthalate, polyethylene terephthalate, polyester, polyester copolymers and fluorinated polymers. ### Claim 27 (depends on 16) The optoelectronic component as claimed in claim 16, wherein the second thermoplastic material is radiation-crosslinked. ### Claim 28 (depends on 16) A method of producing the optoelectronic component as claimed in claim 16, comprising: A) forming the first partial region of the housing from a material which comprises the first thermoplastic material; B) forming the second partial region of the housing from a material which comprises the second thermoplastic material; C) irradiating the first partial region so that the first thermoplastic material is crosslinked; and D) introducing the radiation-emitting device into a recess of the housing. ### Claim 29 (depends on 28) The method as claimed in claim 28, wherein the first partial region is irradiated in method step C) with an irradiation dosage of 33 to 165 kGy. ### Claim 30 (depends on 28) The method as claimed in claims 28, wherein the forming in method step A) is effected by injection-molding. ### Claim 31 An optoelectronic component comprising: a housing which comprises a first partial region having a first thermoplastic material and a second partial region having a second thermoplastic material, wherein the first partial region is formed as a housing base body; a recess in the housing; and a radiation-emitting device disposed in the recess; wherein 1) the first thermoplastic material is at least one selected from the group consisting of polyetherimide, polysulfone and PEEK and has been crosslinked by irradiation, 2) the second thermoplastic material is at least one selected from the group consisting of polyamide, polybutylene terephthalate, polyethylene terephthalate, polyester, polyester copolymers and fluorinated polymers, and 3) the second thermoplastic material has a higher degree of reflectivity with respect to the radiation emitted by the radiation-emitting device, than the first thermoplastic material.