# US 2013/0155607 A1 · Cooling system for electronic device

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- Number: US 2013/0155607 A1
- Document ID: US20130155607A1
- Status: Published application
- Kind: A1
- Application number: 13/340,684
- Filed: 2011-12-30
- Published: 2013-06-20
- Earliest claimed: 2011-12-15
- Assignees: Hon Hai Precision Industry Co., Ltd.
- Inventors: CHAO-KE WEI
- Web page: https://patentgrep.com/patent/US20130155607A1

## CPC

- H05K 7/20827: {within rooms for removing heat from cabinets, e.g. air conditioning devices}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A cooling system is used for cooling an electronic apparatus in an electronic device. The electronic device includes a top wall, a bottom wall, a first sidewall, and a second sidewall. The electronic apparatus is supported on a middle of the bottom plate. The cooling system includes an evaporator, a fan, a condenser, a heat sink attached to the condenser, and a refrigerant pipe connected between the condenser and the evaporator. The heat sink and the condenser are set on an inner surface of the first sidewall. The fan is set on the first sidewall and aligns with the heat sink. The condenser operates to cool refrigerant and transfers the cooled refrigerant to the evaporator. A first airflow cooled by and coming from the evaporator flows through the electronic apparatus and the condenser to cool the electronic apparatus and the condenser, and is then vented through the fan.

## Claims

### Claim 1

A cooling system for cooling an electronic apparatus in an electronic device, the electronic device comprising a top wall, a bottom wall, a first sidewall, and a second sidewall, the electronic apparatus being supported on a middle of the bottom plate, the cooling system comprising:
an evaporator;
a condenser;
a heat sink attached to the condenser, wherein the heat sink and the condenser are set on an inner surface of the first sidewall;
a fan set on the first sidewall and aligning with the heat sink; and
a refrigerant pipe connected between the condenser and the evaporator;
wherein the condenser operates to cool refrigerant and transfers the cooled refrigerant to the evaporator, a first airflow cooled by and coming from the evaporator flows through the electronic apparatus and the condenser to cool the electronic apparatus and the condenser, and is then vented through the fan.

### Claim 2 (depends on 1)

The cooling system of claim 1, wherein the second sidewall defines a plurality of through holes, and second airflow coming from the through holes flows through the electronic apparatus and the condenser to cool the electronic apparatus, the condenser, and the heat sink, and is then vented through the fan.

### Claim 3 (depends on 1)

The cooling system of claim 1, wherein an adiabatic plate is arranged between a top of the electronic apparatus and the top wall.

### Claim 4

An electronic device, comprising:
a top wall;
a bottom wall;
a first sidewall;
a second sidewall;
an electronic apparatus being supported on a middle of the bottom plate;
an evaporator;
a condenser;
a heat sink attached to the condenser, wherein the heat sink and the condenser are set on an inner surface of the first sidewall;
a fan set on the first sidewall and aligning with the heat sink; and
a refrigerant pipe connected between the condenser and the evaporator;
wherein the condenser operates to cool refrigerant and transfers the cooled refrigerant to the evaporator, a first airflow cooled by and coming from the evaporator flows through the electronic apparatuses and the condenser to cool the electronic apparatus and the condenser, and is then vented through the fan.

### Claim 5 (depends on 4)

The electronic device of claim 4, wherein the second sidewall defines a plurality of through holes, and second airflow coming from the through holes flows through the electronic apparatus and the condenser to cool the electronic apparatus, the condenser, and the heat sink, and is then vented through the fan.

### Claim 6 (depends on 4)

The electronic device of claim 4, wherein an adiabatic plate is arranged between a top of the electronic apparatus and the top wall.

### Claim 7 (depends on 4)

The electronic device of claim 4, wherein the electronic device is a container data center, the electronic apparatus is a rack server.

### Claim 8 (depends on 4)

The electronic device of claim 4, wherein the electronic device is a rack server, and the electronic apparatus is a server module.