# US 2013/0155601 A1 · Monitoring system for monitoring serial advanced technology attachment dual in-line memory module

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- Number: US 2013/0155601 A1
- Document ID: US20130155601A1
- Status: Published application
- Kind: A1
- Application number: 13/340,646
- Filed: 2011-12-29
- Published: 2013-06-20
- Earliest claimed: 2011-12-20
- Assignees: Hon Hai Precision Industry Co., Ltd.; HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
- Inventors: BO TIAN
- Web page: https://patentgrep.com/patent/US20130155601A1

## CPC

- G06F 11/3037: {where the computing system component is a memory, e.g. virtual memory, cache (accessing, addressing or allocating within memory systems or architectures G06F12/00; checking stores for correct operation G11C29/00)}
- G06F 11/3051: {Monitoring arrangements for monitoring the configuration of the computing system or of the computing system component, e.g. monitoring the presence of processing resources, peripherals, I/O links, software programs (verification or detection of system hardware configuration G06F11/2247)}
- G06F 11/3093: {Configuration details thereof, e.g. installation, enabling, spatial arrangement of the probes}
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)

## Abstract

A monitoring system includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board, a motherboard having a monitoring unit, and a monitoring device. An edge connector is set on a bottom edge of the circuit board to engage in a memory slot of the motherboard. A SATA connector is arranged on the circuit board and connected to a storage device interface of the motherboard. The monitoring unit receives a working state signal and a data transfer rate signal of the SATA DIMM module and outputs the received signals to the monitoring device.

## Claims

### Claim 1

A monitoring system comprising:
a monitoring device;
a motherboard comprising:
a storage device interface;
a power interface;
a memory slot comprising:
a plurality of first power pins, a plurality of first ground pins, and first and second monitoring signal pins; and
a monitoring unit comprising:
an integrated baseboard management controller (IBMC); and
a collecting chip, wherein first and second input pins of the collecting chip are respectively connected to the first and second monitoring signal pins of the memory slot, a voltage pin of the collecting pin is connected to the power interface and also grounded through a capacitor, each of first to third input/output (I/O) pins of the collecting chip is grounded through a resistor, an interrupt pin of the collecting chip is connected to the IBMC, each of a clock pin and a data pin of the collecting chip is connected to the IBMC through a resistor; and
a serial advanced technology attachment dual-in-line memory module (SATA DIMM) comprising:
a circuit board;
an edge connector set on a bottom edge of the circuit board and engaged in the memory slot, the edge connector comprising a plurality of second power pins connected to the first power pins, a plurality of second ground pins connected to the first ground pins, and third and fourth monitoring signal pins connected to the corresponding first and second monitoring signal pins;
a control chip arranged on the circuit board and connected to the plurality of second power pins, wherein the control chip comprises first and second I/O pins, the first and second I/O pins of the control chip are connected to the corresponding third and fourth monitoring signal pins;
a plurality of storage chips arranged on the circuit board, and connected to the plurality of second power pins and the control chip; and
a SATA connector arranged on the circuit board, and connected to the control chip and the storage device interface of the motherboard;
wherein the first and second I/O pins of the control chip respectively output a working state signal and a data transfer rate signal to the collecting chip through the third and fourth monitoring signal pins of the SATA DIMM module and the first and second monitoring signal pins of the memory slot, the collecting chip converts the received working state signal and data transfer rate signal, and outputs the converted signals to the IBMC, the IBMC encodes the converted signals and outputs the encoded signals to the monitoring device.

### Claim 2 (depends on 1)

The monitoring system of claim 1, wherein the memory slot is a double data rate type three (DDR3) memory slot.

### Claim 3 (depends on 1)

The monitoring system of claim 1, wherein the memory slot is a double data rate type two (DDR2) memory slot.

### Claim 4 (depends on 1)

The monitoring system of claim 1, wherein a notch is defined in the bottom edge of the circuit board, the memory slot comprises a protrusion engaged in the notch.

### Claim 5 (depends on 1)

The monitoring system of claim 1, wherein the circuit board is rectangular, two grooves are defined in two opposite ends of the circuit board, two fixing elements are arranged at two opposite ends of the memory slot, to engage in the grooves of the circuit board.

### Claim 6 (depends on 1)

The monitoring system of claim 1, wherein the monitoring unit further comprises a storage chip connected to the IBMC, to store the working state signal and the data transfer rate signal encoded by the IBMC.