# US 2013/0155151 A1 · Method of manufacturing liquid ejection head > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0155151 A1 - Document ID: US20130155151A1 - Status: Published application - Kind: A1 - Application number: 13/706,513 - Filed: 2012-12-06 - Published: 2013-06-20 - Earliest claimed: 2011-12-15 - Assignees: Canon Kabushiki Kaisha - Inventors: Shimpei Otaka; Takayuki Ono - Web page: https://patentgrep.com/patent/US20130155151A1 ## CPC - B41J 2/14072: {Electrical connections, e.g. details on electrodes, connecting the chip to the outside...} - B41J 2/16: Production of nozzles - B41J 2/1623: {bonding and adhesion} - B41J 2202/19: Assembling head units - B41J 2202/20: Modules - Y10T 428/24273: including aperture - B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A support substrate and a liquid ejecting element substrate are bonded to each other with an adhesive agent to manufacture a liquid ejection head. The support substrate is provided with a liquid supply port and a recess or through hole in its main surface. The adhesive agent is applied onto the main surface of the support substrate by means of a roller holding the adhesive agent on its peripheral surface by moving the support substrate and the roller relative to each other such that the recess or through hole and the liquid supply port sequentially face the roller in this order. ## Claims ### Claim 1 A method of manufacturing a liquid ejection head comprising: a step of preparing a plate substrate having a surface provided with an aperture for supplying liquid and a recess or through hole; and a step of rotating a roller holding an adhesive agent on a peripheral surface thereof and transferring the adhesive agent onto the surface of the plate substrate; the recess or through hole and the aperture being arranged in this order as viewed in the transfer direction. ### Claim 2 (depends on 1) The method according to claim 1, wherein the plate substrate has a plurality of apertures and one or more recesses or through holes are formed as corresponding to each of the apertures. ### Claim 3 (depends on 2) The method according to claim 2, wherein each of the apertures and the corresponding one of the recesses or through holes are separated by a gap which is substantially the same for all the apertures as viewed in the transfer direction. ### Claim 4 (depends on 1) The method according to claim 1, wherein the width of the recess or through hole is greater than the width of the aperture as viewed in the direction orthogonal to the transfer direction. ### Claim 5 (depends on 1) The method according to claim 1, wherein the depth of the recess or through hole is greater than the thickness of the adhesive agent held by the roller. ### Claim 6 (depends on 1) The method according to claim 1, wherein the recess or through hole has a front side wall as viewed in the transfer direction which is formed so as to be perpendicular or inclined relative to the surface of the plate substrate and a back side wall as viewed in the transfer direction which is formed so as to be perpendicular to the same surface. ### Claim 7 (depends on 1) The method according to claim 1, further comprising, after the step of transferring the adhesive agent, a step of bonding a recording element substrate having an energy generating element for ejecting liquid and a wiring substrate to the surface of the plate substrate. ### Claim 8 (depends on 7) The method according to claim 7, wherein the adhesive agent is an adhesive agent for bonding the recording element substrate and the wiring substrate to the plate substrate. ### Claim 9 A plate substrate comprising: a surface for receiving an adhesive agent held by a roller so as to be transferred thereto; an aperture formed in the surface, for supplying liquid; and a recess or through hole formed in the surface; the recess or through hole and the aperture being arranged in the surface in this order as viewed in the transfer direction. ### Claim 10 (depends on 9) The plate substrate according to claim 9, wherein the plate substrate has a plurality of apertures and one or more recesses or through holes as corresponding to each of the apertures. ### Claim 11 (depends on 10) The plate substrate according to claim 10, wherein each of the apertures and the corresponding one of the recesses or through holes are separated by a gap which is substantially the same for all the apertures as viewed in the transfer direction. ### Claim 12 (depends on 9) The plate substrate according to claim 9, wherein the width of the recess or through hole is greater than the width of the aperture as viewed in the direction orthogonal to the transfer direction. ### Claim 13 (depends on 9) The plate substrate according to claim 9, wherein the depth of the recess or through hole is greater than the thickness of the adhesive agent held by the roller. ### Claim 14 (depends on 9) The plate substrate according to claim 9, wherein the recess or through hole has a front side wall as viewed in the transfer direction which is formed so as to be perpendicular or inclined relative to the surface of the plate substrate and a back side wall as viewed in the transfer direction which is formed so as to be perpendicular to the surface. ### Claim 15 (depends on 9) A liquid ejection head comprising a plate substrate as defined in claim 9 and a recording element substrate having an energy generating element for ejecting liquid and a wiring substrate bonded to the surface of the plate substrate. ### Claim 16 (depends on 15) The liquid ejection head according to claim 15, wherein an electric conduction pad is formed on the wiring substrate, and the recess or through hole is located at a position not overlapping the electric conduction pad. ### Claim 17 A method of manufacturing a liquid ejection head comprising: a step of preparing a support substrate provided with a liquid supply port for supplying liquid and a recess or through hole in a main surface thereof; a step of transferring an adhesive agent onto the main surface by moving the support substrate and a roller holding the adhesive agent relative to each other so as to make the recess or through hole and the liquid supply port sequentially face the roller in this order; and a step of bonding the support substrate and a recording element substrate having an energy generating element for ejecting liquid by means of the adhesive agent. ### Claim 18 (depends on 17) The method according to claim 17, wherein a plurality of liquid supply ports are formed in the main surface and a recess or through hole is formed between any two adjacently arranged liquid supply ports as viewed in the direction of relative movement of the roller and the support substrate. ### Claim 19 (depends on 17) The method according to claim 17, wherein a first liquid supply port, a recess or through hole and a second liquid supply port are formed in this order on the main surface such that a gap between the second liquid supply port and the recess or through hole is smaller than a gap between the first liquid supply port and the recess or through hole as viewed in the direction of relative movement of the roller and the support substrate. ### Claim 20 (depends on 17) The method according to claim 17, wherein the length of the recess or through hole is greater than the length of the liquid supply port as viewed in the direction orthogonal to the direction of relative movement of the roller and the support substrate.