# US 2013/0154885 A1 · Multilayered film element

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- Number: US 2013/0154885 A1
- Document ID: US20130154885A1
- Status: Published application
- Kind: A1
- Application number: 13/805,416
- Filed: 2011-06-11
- Published: 2013-06-20
- Earliest claimed: 2010-06-21
- Assignees: Leonhard Kurz Stiftung & Co. KG
- Inventors: Ulrich Schindler; Christian Schumacher; Stefan Mieslinger
- Web page: https://patentgrep.com/patent/US20130154885A1

## CPC

- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- G06K 19/077: Constructional details, e.g. mounting of circuits in the carrier
- G06K 19/07722: {the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00)}
- G06K 19/07779: {the inductive antenna being a coil}
- H01Q 1/2225: {used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal}
- H01Q 7/00: Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H05K 3/305: {Affixing by adhesive}
- H10W 70/699: {for flat cards, e.g. credit cards}
- H05K 1/165: {incorporating printed inductors}
- H05K 3/38: Improvement of the adhesion between the insulating substrate and the metal
- H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

The invention relates to a multilayered film element (1) comprising a first component, more particularly an RFID antenna in the form of a multilayered film element, and to a method for fixing a second component on a film element (1) of this type. The film element (1) has a dielectric layer (10) having a front side (10V) and a rear side (10R). The film element (1) has a layer (11, 12) forming a first component, and at least one component contact area (23, 24) arranged on the front side (10V) and connected to the first component. The film element (1) has at least one thermode contact layer (30) which is arranged on the dielectric layer (10) and which, as seen perpendicularly to the dielectric layer (10), is arranged in the region of the at least one component contact area (23, 24). The thermode contact layer (30) has a thermode contact area (32) on a side facing away from the dielectric layer (10), said thermode contact area forming an outer surface of the film element (1).

## Claims

### Claim at position 1

1-24. (canceled)

### Claim 25

A multilayered film element comprising a dielectric layer having a front side and a rear side situated opposite the front side, wherein the film element has a layer forming a first component, and at least one component contact area arranged on the front side and connected to the first component and serving for arranging a second component, wherein the film element has at least one thermode contact layer which is arranged on the dielectric layer and which, as seen perpendicularly to the dielectric layer, is arranged in the region of the at least one component contact area and has a thermode contact area on a side of the at least one thermode contact layer facing away from the dielectric layer, said thermode contact area forming an outer surface of the film element, and
wherein the layer forming the first component is a metal layer having a thickness of 1 μm to 50 μm, and wherein that the thermode contact layer is likewise embodied as a metal layer.

### Claim 26 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the layer forming the first component is a metal layer having a layer thickness of 5 μm to 15 μm.

### Claim 27 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the first component is an antenna structure.

### Claim 28 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the at least one component contact area is electrically connected to the first component.

### Claim 29 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the at least one component contact area is a chip contact area for arranging an electronic microchip.

### Claim 30 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the at least one thermode contact layer is embodied as a front-side thermode contact layer which is arranged on the front side and which encloses the at least one component contact area at least in regions, and/or as a rear-side thermode contact layer which is arranged on the rear side and which overlaps and/or encloses the at least one component contact area, as seen perpendicularly to the dielectric layer, at least in regions.

### Claim 31 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the rear-side thermode contact layer completely covers the at least one component contact area, as seen perpendicularly to the dielectric layer.

### Claim 32 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the front-side thermode contact layer and a rear-side thermode contact layer are thermally coupled to one another by a heat-conducting component.

### Claim 33 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the at least one thermode contact layer is formed from a material having a thermal conductivity of greater than 50 W/(m K).

### Claim 34 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the layer forming the first component is a metal layer composed of iron, copper, aluminum, nickel, silver, gold, platinum, tin, zinc or an alloy of these metals and/or a multilayer system.

### Claim 35 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the at least one thermode contact area has a circular or rectangular contour.

### Claim 36 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the at least one thermode contact area, as measured in the plane of the dielectric layer, has a maximum extent in the range of 5 to 25 mm.

### Claim 37 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the at least one thermode contact layer has a maximum layer thickness in the range of 6 to 14 μm.

### Claim 38 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the at least one thermode contact layer, as seen perpendicularly to the dielectric layer, comprises two or more partial regions.

### Claim 39 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the layer forming the first component has a first layer arranged on the front side, a second layer arranged on the rear side, and one or more plated-through holes which penetrate through the dielectric layer and by means of which the first layer and the second layer are electrically conductively connected to one another, wherein the at 30 least one thermode contact layer and the one or more plated-through holes, as seen perpendicularly to the dielectric layer, are arranged without mutual overlap, and preferably have a distance of at least 200 μm.

### Claim 40 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the thermode contact area, as seen perpendicularly to the dielectric layer, has one or more cutouts penetrating completely through the at least one thermode contact layer, wherein the cutouts and/or the thermode contact area surrounding the cutouts provide an optical information item.

### Claim 41 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the thermode contact area has a surface relief, which brings about an optical effect.

### Claim 42 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the at least one thermode contact layer is electrically conductively connected to the layer forming the first component and/or to the at least one component contact area, or is electrically insulated from the layer forming the first component and/or from the at least one component contact area.

### Claim 43 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the at least one thermode contact layer forms a part of an electrical component of the film element.

### Claim 44 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the at least one thermode contact layer is formed from a material that is anisotropic with regard to thermal conductivity.

### Claim 45 (depends on 25)

The multilayered film element as claimed in claim 25, wherein the at least one thermode contact layer comprises nanoparticles and/or nanotubes and/or mixtures thereof.

### Claim 46 (depends on 25)

A method for fixing a second component on a multilayered film element as claimed in claim 25, wherein the method comprises the following steps:
coating a side of the second component which has contact areas and/or the at least one component contact area with a thermally activatable conductive, adhesive;
arranging the side of the second component which has the contact areas on the at least one component contact area;
contacting the at least one thermode contact area with a thermode for activating the connecting means; and
separating the thermode from the at least one thermode contact area after the connecting means has been activated.

### Claim 47 (depends on 46)

The method as claimed in claim 46, wherein the contact areas of the second component are embodied as electrical contacts.

### Claim 48 (depends on 46)

The method as claimed in claim 46, wherein the method furthermore comprises the following step:
severing an electrically conductive connection between the at least one thermode contact layer and the layer forming the first component, and/or the at least one component contact area.