# US 2013/0154762 A1 · MEMS Switches in an Integrated Circuit Package

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2013/0154762 A1
- Document ID: US20130154762A1
- Status: Published application
- Kind: A1
- Application number: 13/772,251
- Filed: 2013-02-20
- Published: 2013-06-20
- Earliest claimed: 2007-12-13
- Assignees: Broadcom Corporation
- Inventors: Ahmadreza Rofougaran; Maryam Rofougaran
- Web page: https://patentgrep.com/patent/US20130154762A1

## CPC

- H01P 1/10: for switching or interrupting {(in systems using reflection or reradiation of radio, acoustic or other waves G01S7/034)}
- G02B 26/001: {based on interference in an adjustable optical cavity (interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26)}
- H01H 1/0036: {Switches making use of microelectromechanical systems [MEMS] (for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009)}
- H01P 1/127: {Strip line switches}
- H01P 3/003: {Coplanar lines}
- H04B 1/48: in circuits for connecting transmitter and receiver to a common transmission path, e.g. by energy of transmitter {(H04B1/46 takes precedence)}
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H01H: ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES (contact cables H01B7/10; electrolytic self-interrupters H01G9/18; emergency protective circuit arrangements H02H; switching by electronic means without contact-making H03K17/00)
- H04B: TRANSMISSION

## Abstract

Methods and systems for MEMS switches fabricated in an integrated circuit package are disclosed and may include controlling switching of RF components, and signals handled by the RF components, within an integrated circuit. One or more MEMS switch arrays embedded within a multi-layer package bonded to the integrated circuit may be utilized for the switching and signal control. The RF components and one or more MEMS switch arrays may be integrated in the multi-layer package. The RF components may be electrically coupled to the integrated circuit via the one or more MEMS switch arrays. The MEMS switch arrays may be electrostatically or magnetically activated. The RF components may be coupled to one or more capacitor arrays in the integrated circuit. The RF components may include transformers, inductors, transmission lines, microstrip and/or coplanar waveguide filters and/or surface mount devices. The integrated circuit may be coupled to the multiple-layer package utilizing a flip-chip bonding technique.

## Claims

### Claim at position 1

1-24. (canceled)

### Claim 25

A wireless communication system comprising:
a multi-layer package bonded to an integrated circuit, wherein said multi-layer package comprises an RF component and a MEMS switch array, and wherein said RF component is electrically coupled to said integrated circuit via said MEMS switch array;
wherein said RF component is coupled to a capacitor array within said integrated circuit, and wherein said MEMS switch array is magnetically activated.

### Claim 26 (depends on 25)

The wireless communication system of claim 25, wherein said RF component is tuned by said MEMS switch array.

### Claim 27 (depends on 25)

The wireless communication system of claim 25, wherein said RF component is tuned by said integrated circuit.

### Claim 28 (depends on 25)

The wireless communication system of claim 25, wherein said RF component is switched by said MEMS switch array.

### Claim 29 (depends on 25)

The wireless communication system of claim 25, wherein said RF component is switched by said integrated circuit.

### Claim 30 (depends on 25)

The wireless communication system of claim 25, wherein said MEMS switch array is electrostatically activated.

### Claim 31 (depends on 25)

The wireless communication system of claim 25, wherein said RF component comprises a transformer.

### Claim 32 (depends on 25)

The wireless communication system of claim 25, wherein said RF component comprises an inductor.

### Claim 33 (depends on 25)

The wireless communication system of claim 25, wherein said RF component comprises a transmission line.

### Claim 34 (depends on 25)

The wireless communication system of claim 25, wherein said RF component comprises a microstrip filter.

### Claim 35 (depends on 25)

The wireless communication system of claim 25, wherein said RF component comprises a coplanar filter.

### Claim 36 (depends on 25)

The wireless communication system of claim 25, wherein said RF component comprises a surface mount device.

### Claim 37 (depends on 25)

The wireless communication system of claim 25, wherein said integrated circuit is coupled to said multiple-layer package as a flip-chip.

### Claim 38

A method comprising:
in a wireless system, controlling switching of an RF component and signals handled by said RF component within an integrated circuit by a MEMS switch array integrated in a multi-layer package;
wherein said RF component is coupled to a capacitor array integrated in said multi-layer package.

### Claim 39 (depends on 38)

The method of claim 38, wherein said MEMS switch array is magnetically activated.

### Claim 40 (depends on 38)

The method of claim 38, wherein said RF component is tuned by said MEMS switch array.

### Claim 41 (depends on 38)

The method of claim 38, wherein said RF component is tuned by said integrated circuit.

### Claim 42 (depends on 38)

The method of claim 38, wherein said RF component comprises a transformer.

### Claim 43 (depends on 38)

The method of claim 38, wherein said RF component comprises an inductor.

### Claim 44 (depends on 38)

The method of claim 38, wherein said MEMS switch array is electrostatically activated.