# US 2013/0154759 A1 · Waveguide, interposer substrate including the same, module, and electronic apparatus

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- Number: US 2013/0154759 A1
- Document ID: US20130154759A1
- Status: Published application
- Kind: A1
- Application number: 13/688,728
- Filed: 2012-11-29
- Published: 2013-06-20
- Earliest claimed: 2011-12-14
- Assignees: Sony Corporation
- Inventors: Shinya Morita; Koichi Ikeda; Akira Akiba; Mitsuo Hashimoto
- Web page: https://patentgrep.com/patent/US20130154759A1

## CPC

- H01P 3/081: {Microstriplines}
- H01P 5/107: Hollow-waveguide/strip-line transitions
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A waveguide includes: a waveguide portion including a first surface and a second surface that are opposed to each other; a first transmission line provided on the first surface of the waveguide portion; a second transmission line provided on the second surface of the waveguide portion; and a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.

## Claims

### Claim 1

A waveguide, comprising:
a waveguide portion including a first surface and a second surface that are opposed to each other;
a first transmission line provided on the first surface of the waveguide portion;
a second transmission line provided on the second surface of the waveguide portion; and
a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.

### Claim 2 (depends on 1)

The waveguide according to claim 1, further comprising a second conversion structure that outputs the signal from the waveguide portion to the second transmission line and converts the signal.

### Claim 3 (depends on 1)

The waveguide according to claim 1, wherein the waveguide portion includes a pair of conductive films that are opposed to each other, and a plurality of conductive pillars that connect the pair of conductive films together.

### Claim 4 (depends on 1)

The waveguide according to claim 1, wherein the waveguide portion includes a pair of conductive films that are opposed to each other, and a pair of conductor walls that are disposed to oppose each other between the pair of conductive films.

### Claim 5 (depends on 1)

The waveguide according to claim 1, wherein the first transmission line, the second transmission line, or both of the first transmission line and the second transmission line comprises a microstrip line.

### Claim 6 (depends on 1)

The waveguide according to claim 1, wherein the first conversion structure and the second conversion structure each comprise a through electrode.

### Claim 7 (depends on 1)

The waveguide according to claim 1, wherein the first conversion structure and the second conversion structure each comprise a tapered microstrip.

### Claim 8

An interposer substrate with an insulating substrate and a waveguide provided in the substrate, the waveguide comprising:
a waveguide portion including a first surface and a second surface that are opposed to each other;
a first transmission line provided on the first surface of the waveguide portion;
a second transmission line provided on the second surface of the waveguide portion; and
a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.

### Claim 9 (depends on 8)

The interposer substrate according to claim 8, wherein the substrate comprises any one of: a high-resistance silicon substrate having a resistivity of about 1000 Ω·cm or higher; a low-temperature co-fired ceramic; a glass; quartz; and a ceramic.

### Claim 10

A module with an interposer substrate and a semiconductor chip, the interposer substrate being provided with a waveguide in an insulating substrate, and the semiconductor chip being mounted on the interposer substrate, the waveguide comprising:
a waveguide portion including a first surface and a second surface that are opposed to each other;
a first transmission line provided on the first surface of the waveguide portion;
a second transmission line provided on the second surface of the waveguide portion; and
a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.

### Claim 11

An electronic apparatus with an interposer substrate, a semiconductor chip, and a mounted substrate, the interposer substrate being provided with a waveguide in an insulating substrate, the semiconductor chip being mounted on the interposer substrate, and the mounted substrate being electrically connected with the interposer substrate, the waveguide comprising:
a waveguide portion including a first surface and a second surface that are opposed to each other;
a first transmission line provided on the first surface of the waveguide portion;
a second transmission line provided on the second surface of the waveguide portion; and
a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.