# US 2013/0154681 A1 · Substrate inspection jig and substrate inspection method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0154681 A1 - Document ID: US20130154681A1 - Status: Published application - Kind: A1 - Application number: 13/714,869 - Filed: 2012-12-14 - Published: 2013-06-20 - Earliest claimed: 2011-12-15 - Assignees: Ricoh Company, Ltd. - Inventors: Keishi Miyanishi; Yuji Miura; Shinji Nagai; Tomohiko Shiki; Tadayoshi Shibasaki; Hideo Watanabe; Katsuhiro Tanabe; Hiroyuki Inakazu; Yasukazu Sadakane; Tomoko Kawakami - Web page: https://patentgrep.com/patent/US20130154681A1 ## CPC - G01R 1/0408: {Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets (G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808)} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A substrate inspection jig for use in inspection of an electrical property of a printed board to be inspected on which an electronic component is mounted includes a spacer which is mounted on the printed board to be inspected, a conductive plate which is connected to the spacer, and is disposed along an arrangement direction of electrode terminals of the electronic component to be inspected, and a fastener which fastens the spacer on the printed board to be inspected, wherein the plate is disposed above the printed board to be inspected so as to avoid contact with the printed board to be inspected, and a predetermined potential of the printed board to be inspected is set to the plate through the spacer or/and the fastener. ## Claims ### Claim 1 A substrate inspection jig for use in inspection of an electrical property of a printed board to be inspected on which an electronic component is mounted, comprising: a spacer which is mounted on the printed board to be inspected; a conductive plate which is connected to the spacer, and is disposed along an arrangement direction of electrode terminals of the electronic component to be inspected; and a fastener which fastens the spacer on the printed board to be inspected, wherein the plate is disposed above the printed board to be inspected so as to avoid contact with the printed board to be inspected, and a predetermined potential of the printed board to be inspected is set to the plate through the spacer or/and the fastener. ### Claim 2 (depends on 1) The substrate inspection jig according to claim 1, wherein the spacer has a conductive property, and has contact with a land portion having a reference potential on the printed board to be inspected. ### Claim 3 (depends on 1) The substrate inspection jig according to claim 1, wherein the spacer includes on an outer periphery thereof a male screw, the male screw is threadably mounted on a female screw formed in the plate, and a height of the threadably mounted plate from the printed board to be inspected is adjusted by rotating the spacer. ### Claim 4 (depends on 1) The substrate inspection jig according to claim 1, wherein the spacer is disposed on both end sides relative to the plate. ### Claim 5 (depends on 1) The substrate inspection jig according to claim 1, wherein the fastener includes a metal screw which is threadably mounted on a female screw formed in the spacer through a hole from a back surface opposite to a surface provided with the electronic component of the printed board to be inspected, so as to fasten the spacer on the printed board to be inspected, and a head portion of the metal screw has contact with a land portion having a reference potential formed around the hole on the back surface of the printed board to be inspected, so that a potential of the plate is set through the spacer or the head portion of the metal screw has direct contact with the plate, so that the potential of the plate is set. ### Claim 6 (depends on 1) The substrate inspection jig according to claim 1, wherein the plate includes a plate fastener electrically connected to the spacer, a conductive guide section having an end portion connected to the plate fastener, and disposed along the arrangement direction of the electrode terminals of the electronic component, a conductive substantially cuboid plate-moving section which is movable along the arrangement direction of the electrode terminals by sliding the guide section, and a plate-locking section which locks the plate-moving section to the guide section in an arbitrary position. ### Claim 7 (depends on 1) The substrate inspection jig according to claim 1, wherein the plate includes a plate fastener electrically connected to the spacer, a conductive guide section having an end portion connected to penetrate through the plate fastener, and disposed along the arrangement direction of the electrode terminals of the electronic component, a conductive substantially cuboid plate-moving section which is movable along the arrangement direction of the electrode terminals by sliding the guide member, a plate-locking section which locks the plate-moving section to the guide section in an arbitrary position, and a guide locking section which locks the guide section to the plate fastener in an arbitrary position. ### Claim 8 (depends on 6) The substrate inspection jig according to claim 6, wherein the plate fastener is disposed such that at least two guide sections are orthogonal to each other, and the two guide sections are held in the plate fastener disposed to face a corner portion of two orthogonal sides of the electronic component to be inspected, so that the plate-moving section is movable along the two sides. ### Claim 9 (depends on 8) The substrate inspection jig according to claim 8, wherein the plate fastener is disposed in a square shape such that the guide sections are orthogonal to each other relative to each plate fastener disposed corresponding to four corner portions of the electronic component to be inspected, so that the plate-moving section is movable along four sides of the electronic component. ### Claim 10 (depends on 6) The substrate inspection jig according to any one of claim 6, wherein a plurality of grooves each having a predetermined width is arranged in a corner portion of an upper portion on a side facing the electrode terminals of the electrode component in the plate-moving section according to pitches of the electrode terminals along the guide section sliding direction. ### Claim 11 (depends on 10) The substrate inspection jig according to claim 10, wherein grooves having pitches different from the pitches of the grooves formed in the corner portion of the upper portion in the plate-moving section are formed in a corner portion of a lower portion on the side facing the electrode terminals of the electronic component in the plate-moving section along the guide section sliding direction. ### Claim 12 (depends on 10) The substrate inspection jig according to claim 10, wherein one end of the groove opens at the corner portion and the other end of the groove is grooved at a predetermined length from the corner portion in the direction orthogonal to the guide section sliding direction. ### Claim 13 A substrate inspection method of inspecting an electrical property of a printed board to be inspected on which an electronic component is mounted, comprising the steps of preparing a substrate inspection jig including a spacer which is mounted on the printed board to be inspected, a conductive plate which is connected to the spacer and is disposed along an arrangement direction of electrode terminals of the electronic component, and a fastener which fastens the spacer on the printed board to be inspected, disposing the plate above the printed board to be inspected so as to avoid contact with the printed board to be inspected, and setting a predetermined potential of the printed board to be inspected to the plate through the spacer and/or the fastener by using the substrate inspection jig, and inspecting the electronic property of the printed board to be inspected with a potential of the plate as a reference. ### Claim 14 (depends on 1) A substrate inspection method of inspecting an electrical property of a printed board to be inspected on which an electronic component is mounted, comprising: a step of attaching the substrate inspection jig according to claim 1 on the printed board to be inspected, a step of inspecting the electrical property of the printed board to be inspected with a potential of the plate as a reference, and a step of removing the printed board to be inspected from the substrate inspection jig after the inspection.