# US 2013/0154675 A1 · Substrate holding device and method, and inspection apparatus and method using the substrate holding device and method

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- Number: US 2013/0154675 A1
- Document ID: US20130154675A1
- Status: Published application
- Kind: A1
- Application number: 13/580,473
- Filed: 2011-01-14
- Published: 2013-06-20
- Earliest claimed: 2010-03-31
- Assignees: Hitachi High-Technologies Corporation
- Inventors: Yusuke Miyazaki; Kenji Aiko; Yuichiro Iijima; Yuichiro Kato
- Web page: https://patentgrep.com/patent/US20130154675A1

## CPC

- G01R 31/00: Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere ({measuring superconductive properties G01R33/1238;} testing line transmission systems H04B3/46; testing or measuring semiconductors or solid state devices during manufacture {H10P74/00})
- G01N 21/9501: {Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)}
- H10P 72/0616: {Monitoring of warpages, curvatures, damages, defects or the like}
- H10P 72/7608: {characterised by a plurality of separate clamping members, e.g. clamping fingers}
- H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Non-contact type displacement sensors which measure the height of a substrate surface are installed above the substrate in order to hold the upper surface of the substrate at a desired height or to maintain the flatness of the substrate. A substrate mounting device is such that a plurality of grooves and of barriers are provided on the upper surface of a table and air is supplied between the substrate and the table to enable the pressure of air to displace the substrate. In addition, the substrate mounting device has such a structure as to make it possible to deform the substrate into an arbitrary convex-concave shape or to make the substrate flat by feeding back the output of the displacement sensor.

## Claims

### Claim at position 1

-18. (canceled)

### Claim 19

An inspection apparatus for inspecting a substrate, comprising:
a substrate mounting device;
wherein the substrate mounting device includes a holding portion disposed at an outer circumferential portion of the substrate mounting device so as to mount the substrate thereon,
a structure formed at a portion opposed to a rear surface of the substrate, and
a first control section for controlling pressure between the rear surface of the substrate and the structure,
wherein the first control section includes a second control section for controlling volume between the rear surface of the substrate and the structure.

### Claim 20 (depends on 19)

The inspection apparatus according to claim 19,
wherein the structure has a first piezo element, and
the second control section includes a first drive section for driving the first peizo element.

### Claim 21

An inspection apparatus for inspecting a substrate, comprising:
a substrate mounting device;
wherein the substrate mounting device includes a holding portion disposed at an outer circumferential portion of the substrate mounting device so as to mount the substrate thereon,
a structure formed at a portion opposed to a rear surface of the substrate, and
a first control section for controlling pressure between the rear surface of the substrate and the structure,
wherein the holding section includes a second piezo element, and
the inspection apparatus includes a second drive section for driving the second piezo element.

### Claim 22

An inspection method for inspecting a substrate, comprising the steps of:
controlling flatness of the substrate by controlling pressure on a rear surface side of the substrate; and
inspecting the substrate,
wherein concavity-convexity is formed on a portion opposed to the rear surface of the substrate, and
volume between the rear surface of the substrate and the concavity-convexity is controlled.