# US 2013/0154481 A1 · Led light source > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0154481 A1 - Document ID: US20130154481A1 - Status: Published application - Kind: A1 - Application number: 13/665,689 - Filed: 2012-10-31 - Published: 2013-06-20 - Earliest claimed: 2011-10-31 - Inventors: Densen Cao; Steven D. Jensen - Web page: https://patentgrep.com/patent/US20130154481A1 ## CPC - F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks - F21K 9/232: specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb - F21K 9/235: Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps (F21K9/238 takes precedence) - F21K 9/237: Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases (F21K9/238 takes precedence) - F21K 9/90: Methods of manufacture - F21V 3/02: characterised by the shape - F21V 29/503: of light sources (cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H10H20/858) - F21V 29/85: characterised by the material (liquid coolants F21V29/56) - F21V 29/86: {Ceramics or glass} - F21V 29/87: Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor - H05B 33/10: Apparatus or processes specially adapted to the manufacture of electroluminescent light sources - H05B 33/28: of translucent electrodes - F21Y 2107/40: on the sides of polyhedrons, e.g. cubes or pyramids - F21Y 2115/10: Light-emitting diodes [LED] - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract Example embodiments of the present invention provide a LED light source with an effective and efficient heat management system. For example, embodiments of the present invention include devices, systems, materials, and methods to effectively transfer heat away from LEDs used in an LED light source to produce an LED light source that has high lumen output compared to conventional LED light sources. In particular, example embodiments of the present invention provide an LED light source that includes a transparent or translucent heat conductive material in which the LEDs are embedded. ## Claims ### Claim 1 A light source, comprising: a socket connection capable of connecting to a source of electricity; one or more LEDs electrically coupled to the socket connection; a heat conductive material into which the LEDs are embedded, the heat conductive material being substantially translucent or transparent such that light emitted from the LEDs is able to pass through the heat conductive material. ### Claim 2 (depends on 1) The light source recited in claim 1, wherein the heat conductive material is shaped and dimensioned to a standard light source size such that the light source as a whole inherits a standard lighting form factor. ### Claim 3 (depends on 1) The light source recited in claim 1, further comprising an enclosure that surrounds the heat conductive material. ### Claim 4 (depends on 1) The light source recited in claim 1, wherein the heat conductive material is a silicone-based material. ### Claim 5 (depends on 1) The light source recited in claim 1, wherein the heat conductive material is a transparent or translucent ceramic. ### Claim 6 (depends on 1) The light source recited in claim 1, wherein the heat conductive material is an organic wax. ### Claim 7 (depends on 1) The light source recited in claim 1, wherein the heat conductive material is a solid. ### Claim 8 (depends on 1) The light source recited in claim 1, wherein the heat conductive material is a thermoplastic. ### Claim 9 A light source, comprising: a socket connection capable of connecting to a source of electricity; an LED element comprising one or more LEDs, wherein the one or more LEDs receives electricity by way of the socket connection; a heat conductive material into which the LED element is embedded, wherein the heat conductive material is shaped and dimensioned such that the light source meets a standardized form factor. ### Claim 10 (depends on 7) The light source recited in claim 7, wherein the heat conductive material is transparent or translucent to allow light emitted from the one or more LEDs to pass through the heat conductive material. ### Claim 11 (depends on 7) The light source recited in claim 7, wherein the heat conductive material is a silicone-based material. ### Claim 12 (depends on 7) The light source recited in claim 7, wherein the heat conductive material is a transparent or translucent ceramic. ### Claim 13 (depends on 7) The light source recited in claim 7, wherein the heat conductive material is an organic wax. ### Claim 14 (depends on 1) The light source recited in claim 1, wherein the heat conductive material is a solid. ### Claim 15 (depends on 1) The light source recited in claim 1, wherein the heat conductive material is a thermoplastic. ### Claim 16 A method of making a light source, comprising: obtaining a structure that includes one or more LEDs; embedding the one or more LEDs into a heat conductive material; shaping the heat conductive material into desired dimensions and shape to produce a light source. ### Claim 17 (depends on 16) The method of claim 16, wherein shaping the heat conductive material comprises performing an injection molding process with the heat conductive material around the one or more LEDs. ### Claim 18 (depends on 17) The method of claim 17, wherein the obtaining a structure that includes one or more LEDs comprises: obtaining a connection socket; and electrically connecting the one or more LEDs to the connection socket. ### Claim 19 (depends on 18) The method of claim 18, wherein the shaping the heat conductive material into desired dimensions further comprises: choosing a standard light source form factor; and forming the heat conductive material into a standard light source form factor.