# US 2013/0154203 A1 · Device for treating surfaces of wafer-shaped articles and gripping pin for use in the device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0154203 A1 - Document ID: US20130154203A1 - Status: Published application - Kind: A1 - Application number: 13/328,212 - Filed: 2011-12-16 - Published: 2013-06-20 - Earliest claimed: 2011-12-16 - Assignees: Lam Research Corporation - Inventors: Ulrich TSCHINDERLE; Andreas GLEISSNER; Thomas WIRNSBERGER; Franz KUMNIG; Rainer OBWEGER - Web page: https://patentgrep.com/patent/US20130154203A1 ## CPC - H10P 72/7608: {characterised by a plurality of separate clamping members, e.g. clamping fingers} - H10P 72/0414: {using mainly spraying means, e.g. nozzles} - H10P 72/7624: {characterised by the mechanical construction of the susceptor, stage or support} - Y10T 279/17213: Transversely oscillating jaws - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A device for processing wafer-shaped articles comprises a rotary chuck having a series of pins adapted to hold a wafer shaped article on the rotary chuck. Each of the pins comprises a cylindrical body and a projecting gripping portion formed integrally therewith. The cylindrical body and gripping portion are made from a ceramic material. The gripping portion comprises cylindrical surfaces having a common generatrix with surfaces of the cylindrical body. ## Claims ### Claim 1 Device for processing wafer-shaped articles, comprising a rotary chuck having a series of pins adapted to hold a wafer shaped article on said rotary chuck, each of said pins comprising a cylindrical body and a projecting gripping portion formed integrally therewith and being of a ceramic material, said gripping portion comprising cylindrical surfaces having a common generatrix with surfaces of said cylindrical body. ### Claim 2 (depends on 1) The device according to claim 1, further comprising a closed process chamber containing said rotary chuck. ### Claim 3 (depends on 1) The device according to claim 1, wherein each of said series of pins comprises a base portion rigidly mounted in a separate gear element, said device further comprising a ring gear in meshing engagement with each said gear element so as to drive said series of pins in unison over a defined angular range. ### Claim 4 (depends on 3) The device according to claim 3, wherein each said gear element is formed of metal or a thermally resistant and chemically inert plastic material. ### Claim 5 (depends on 1) The device according to claim 1, wherein said ceramic material is selected from the group consisting of Al2O3, Y2O3, SiC, Si3N4, AlN, cordierite (2MgO.2 Al2O3.5SiO2) zirconia (ZrO2), quartz (SiO2) and combinations thereof. ### Claim 6 (depends on 1) The device according to claim 1, wherein each of said series of pins is mounted for rotation about a central axis of said cylindrical body. ### Claim 7 (depends on 1) The device according to claim 1, wherein said cylindrical surfaces of said gripping portion extend over 45° to 270° of circumference of said cylindrical body, preferably over 90° to 235° of circumference of said cylindrical body, more preferably over 135° to 180° of circumference of said cylindrical body, and most preferably over 140° to 175° of circumference of said cylindrical body. ### Claim 8 (depends on 1) The device according to claim 1, wherein said cylindrical surfaces of said gripping portion are interrupted by a groove extending radially inwardly from said cylindrical surfaces, said groove being dimensioned to receive and engage a peripheral edge of a wafer-shaped article having a thickness from 500 to 1,000 microns. ### Claim 9 (depends on 1) The device according to claim 1, wherein each said projecting gripping portion does not extend radially outwardly of its corresponding said cylindrical body and wherein each said projecting gripping portion in plan view overlies not more than two thirds of its corresponding said cylindrical body, thereby to facilitate release of a wafer shaped article from each said gripping portion as said cylindrical surfaces of said gripping portion are moved radially outwardly of an axis of rotation of said chuck by rotation of said cylindrical body about its axis. ### Claim 10 (depends on 1) The device according to claim 1, wherein said rotary chuck is adapted to be driven without physical contact through a magnetic bearing. ### Claim 11 (depends on 1) The device according to claim 1, wherein said cylindrical surfaces of said gripping portion adjoin a radially inwardly extending contact surface adapted to engage a peripheral edge of a wafer-shaped article only on a surface facing away from said rotary chuck. ### Claim 12 (depends on 1) The device according to claim 1, wherein said gripping portion has no plane of symmetry parallel to an axis of said cylindrical body. ### Claim 13 A gripping pin for use in a device for processing wafer-shaped articles, said gripping pin comprising a cylindrical body and a projecting gripping portion formed integrally therewith and being of a ceramic material, said gripping portion comprising cylindrical surfaces having a common generatrix with surfaces of said cylindrical body. ### Claim 14 (depends on 13) The gripping pin according to claim 13, further comprising a base portion rigidly mounted in a separate gear element formed of metal or a thermally resistant and chemically inert plastic material. ### Claim 15 (depends on 13) The gripping pin according to claim 13, wherein said projecting gripping portion does not extend radially outwardly of said cylindrical body and wherein said projecting gripping portion in plan view overlies not more than two thirds of said cylindrical body.