# US 2013/0154162 A1 · System and Method of Optimizing a Composite System > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0154162 A1 - Document ID: US20130154162A1 - Status: Published application - Kind: A1 - Application number: 13/326,923 - Filed: 2011-12-15 - Published: 2013-06-20 - Earliest claimed: 2011-12-15 - Assignees: Bell Helicopter Textron Inc. - Inventors: Stephen K. Bishop; Jacob J. Hart - Web page: https://patentgrep.com/patent/US20130154162A1 ## CPC - G01N 27/021: {before and after chemical transformation of the material} - G01N 33/442: {Resins; Plastics} - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) ## Abstract The present application relates to a method and system for optimizing a composite system by electrically monitoring the reactive and physiological behavior of the resin binder in a composite system, so as to develop the desired properties of the resin during the cure process. A method of manufacturing a composite part can include assembling a composite preform with a resinous material and an open circuit. Further, the method can include subjecting the composite preform to a curing cycle so that a resin in the resinous material melts and closes the open circuit. Further, the method can include electrically monitoring a current through the resin during the curing cycle. Further, the method can include selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin. ## Claims ### Claim 1 A method of characterizing a resin reference signature, the method comprising: locating an open circuit approximate a resinous member; applying a direct current to the open circuit; subjecting the resinous member and the open circuit to a curing cycle so that the resinous member melts, thereby providing conductive path through the open circuit; measuring the direct current traveling through resinous member during the curing cycle. ### Claim 2 (depends on 1) The method according to claim 1, wherein the step of measuring the direct current traveling through resinous member is achieved by measuring a voltage across a resistor. ### Claim 3 (depends on 1) The method according to claim 1, further comprising: locating a filter adjacent the open circuit to prevent conductive particulate matter from shorting the open circuit. ### Claim 4 (depends on 3) The method according to claim 3, wherein the filter is a scrim fabric. ### Claim 5 (depends on 1) The method according to claim 1, wherein the resinous member is a pre-preg material. ### Claim 6 (depends on 1) The method according to claim 1, wherein the resinous member is an adhesive film. ### Claim 7 (depends on 1) The method according to claim 1, further comprising: graphically representing the resin reference signature. ### Claim 8 (depends on 1) The method according to claim 1, further comprising: taking a derivative of the resin reference signature to derive a change in a physiological behavior of the resinous member throughout the cure cycle. ### Claim 9 (depends on 8) The method according to claim 8, further comprising: identifying the change in the physiological behavior of the resinous member as at least one of: a melting point; a catalyst point; a peak minimum viscosity point; a cure finalization point; and a plateau point. ### Claim 10 A method of manufacturing a composite part, the method comprising: assembling a composite preform with a resinous material and an open circuit; subjecting the composite preform to a curing cycle so that a resin in the resinous material melts and closes the open circuit; electrically monitoring a current through the resin during the curing cycle; and selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin. ### Claim 11 (depends on 10) The method according to claim 10, wherein the current is a direct current. ### Claim 12 (depends on 10) The method according to claim 10, wherein the resinous material is a pre-preg material. ### Claim 13 (depends on 10) The method according to claim 10, wherein the step of assembling a composite preform with a resinous material and an open circuit further includes locating a filter adjacent the circuit to prevent conductive particulate matter from shorting the open circuit. ### Claim 14 (depends on 10) The method according to claim 10, wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes: applying mechanical pressure to composite preform when the current through the resin indicates a viscosity of the resin has reached a certain threshold. ### Claim 15 (depends on 10) The method according to claim 10, wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes: terminating the curing cycle when the current through resin indicates the curing of the resin has reached a plateau. ### Claim 16 (depends on 10) The method according to claim 10, wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes: decreasing a heating rate during the curing cycle when the current through the resin indicates that the resin is curing too quickly. ### Claim 17 (depends on 10) The method according to claim 10, wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes: increasing a heating rate during the curing cycle when the current through the resin indicates that the resin is curing too slowly. ### Claim 18 (depends on 10) The method according to claim 10, wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes: customizing a heating rate during the curing cycle so that resin has a certain ductility at the end of the cure cycle. ### Claim 19 (depends on 10) The method according to claim 10, wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes: applying vacuum pressure to composite preform when the current through the resin indicates a viscosity of the resin has reached a certain threshold. ### Claim 20 (depends on 10) The method according to claim 10, wherein the step of selectively controlling a manufacturing variable in response to the step of electrically monitoring the current through the resin includes: changing a rate of a mechanical pressure being applied to the composite preform when the current through the resin indicates a real-time viscosity of the resin is different than predicted.