# US 2013/0154155 A1 · Manufacturing of dsc type electronic devices by means of spacer insert > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0154155 A1 - Document ID: US20130154155A1 - Status: Published application - Kind: A1 - Application number: 13/629,156 - Filed: 2012-09-27 - Published: 2013-06-20 - Earliest claimed: 2011-12-19 - Assignees: STMicroelectronics S.r.l. - Inventors: Tommaso Casabianca; Cristiano Gianluca Stella - Web page: https://patentgrep.com/patent/US20130154155A1 ## CPC - H10W 40/778: {in encapsulations} - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - H10W 74/016: {using moulds} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A DSC type device manufacturing process includes placing a circuit assembly in a mold. The circuit assembly includes a first heat sink, a semiconductor chip mounted on the first heat sink, a second heat sink mounted on the semiconductor chip and a pin block electrically connected to the semiconductor chip. An outer surface of the first heat sink and an outer surface of the pin block are placed in contact with a first inner surface of the mold. A spacer insert is placed in contact with, and positioned between, a second inner surface of the mold and an outer surface of the second heat sink. The mold is filled with an insulating material that is subsequently hardened. After hardening, a resulting device is extracted from the mold with the outer surfaces of the first heat sink, the pin block and the second heat sink exposed. ## Claims ### Claim 1 A process for manufacturing DSC type electronic devices, comprising: placing, in each one of a set of molds, at least one assembly comprising a first heat sink, at least one chip of semiconductor material mounted on the first heat sink, a second heat sink mounted on said at least one chip and a plurality of pin blocks electrically connected to said at least one chip, the first heat sink having an outer surface in contact with a first inner surface of the mold, placing a spacer insert into each mold in contact with an outer surface of the second heat sink, filling each mold with insulating material in the liquid state, hardening the insulating material, and extracting a resulting electronic device from each mold, wherein the hardened insulating material forms a protective package for said at least one chip that exposes both the outer surface of the first heat sink and the outer surface of the second heat sink. ### Claim 2 (depends on 1) The process according to claim 1, wherein placing a spacer insert into each mold comprises: placing a deformable spacer insert into the mold. ### Claim 3 (depends on 2) The process according to claim 2, wherein placing a deformable spacer insert into the mold comprises: placing an elastic spacer insert into the mold. ### Claim 4 (depends on 1) The process according to claim 1, wherein placing, in each one of a set of molds, at least one assembly comprises: placing an outer surface of each pin block in contact with the first inner surface of the mold for obtaining the outer surface of each pin block exposed from the package when the corresponding electronic device is removed from the mold. ### Claim 5 (depends on 1) The process according to claim 1, wherein placing a spacer insert into the mold comprises: placing the spacer insert with a main portion in contact with the outer surface of the second heat sink and a side portion protruding from the main portion towards the first heat sink in contact with a further outer surface of each pin block for obtaining the further outer surface of each pin block being exposed from the package when the corresponding electronic device is removed from the mold. ### Claim 6 (depends on 1) The process according to claim 1, wherein placing, in each one of a set of molds, at least one assembly comprises placing a plurality of assemblies into each mold, and wherein placing a spacer insert into each mold comprises placing the spacer insert into the mold in contact with the outer surface of the second heat sink of each of the assemblies before filling the mold with the insulating material. ### Claim 7 (depends on 1) The process according to claim 1, wherein placing, in each one of a set of molds, at least one assembly comprises: interposing at least one removable protective sheet between the at least one assembly and the corresponding mold. ### Claim 8 (depends on 7) The process according to claim 7, wherein interposing at least one removable protective sheet between the at least one assembly and the corresponding mold comprises: placing a first removable protective sheet into a first half-mold of the mold, and placing a second removable protective sheet into a second half-mold of the mold. ### Claim 9 (depends on 1) The process according to claim 1, wherein placing, in each one of a set of molds, at least one assembly is performed simultaneously for a plurality of molds by: placing the corresponding assemblies on first half-molds of the corresponding molds comprised in a first common matrix, and covering the assemblies with second half-molds of the corresponding molds comprised in a second common matrix. ### Claim 10 (depends on 9) The process according to claim 9, wherein placing the corresponding assemblies on first half-molds of the corresponding molds comprised in a first common matrix comprises: placing a common leadframe on the first common matrix, the leadframe comprising the corresponding first heat sinks and the corresponding pin blocks. ### Claim 11 A process, comprising: placing a circuit assembly in a bottom half of a mold, said bottom half of the mold including a first inner surface and said circuit assembly comprising a first heat sink having a lower surface in contact with the first inner surface, a pin block having a lower surface in contact with the first inner surface, a semiconductor chip in electrical connection with at least the pin block, and a second heat sink in contact with the semiconductor chip; placing a spacer insert within an upper half of the mold, said upper half of the mold including a second inner surface and said spacer insert placed in contact with the second inner surface; coupling the upper half of the mold to the bottom half of the mold to enclose the circuit assembly with the spacer insert in contact with an upper surface of the second heat sink; injecting a cavity formed by the coupled upper half and lower half with an insulating material; hardening the insulating material; and extracting the hardened insulating material encapsulating the circuit assembly from the mold with the lower surface of the first heat sink, the lower surface of the pin block and the upper surface of the second heat sink exposed at an outer surface of the hardened insulating material. ### Claim 12 (depends on 11) The method of claim 11, wherein placing the spacer insert within the upper half of the mold comprises placing the spacer insert in contact with the second inner surface and a third inner surface of the upper half of the mold which is perpendicular to the second inner surface, the spacer insert further contacting, when the upper half of the mold is coupled to the bottom half of the mold, an upper surface of the pin block. ### Claim 13 (depends on 12) The method of claim 12, wherein extracting further comprises the upper surface of the pin block being exposed at the outer surface of the hardened insulating material. ### Claim 14 (depends on 11) The method of claim 11, wherein placing a circuit assembly in the bottom half of the mold comprises placing a first circuit assembly and a second circuit assembly in the bottom half of the mold, further comprising: placing a sacrificial joint between the first circuit assembly and the second circuit assembly; extending a septum from the spacer insert between the first circuit assembly and the second circuit assembly and in contact with the sacrificial joint. ### Claim 15 (depends on 14) The method of claim 14, further comprising, after extracting, severing the sacrificial joint. ### Claim 16 A process, comprising: placing a first sheet in a bottom half of a mold, said bottom half of the mold including a first inner surface to which the first sheet is in contact; placing a circuit assembly in the bottom half of the mold, said circuit assembly comprising a first heat sink having a lower surface in contact with the first sheet, a pin block having a lower surface in contact with the first sheet, a semiconductor chip in electrical connection with at least the pin block, and a second heat sink in contact with the semiconductor chip; placing a spacer insert within an upper half of the mold and in contact with a second inner surface; placing a second sheet in the upper half of the mold in contact with the spacer insert; coupling the upper half of the mold to the bottom half of the mold to enclose the circuit assembly with the second sheet in contact with an upper surface of the second heat sink; injecting a cavity formed by the coupled upper half and lower half with an insulating material; hardening the insulating material; and extracting the hardened insulating material encapsulating the circuit assembly from the mold with the lower surface of the first heat sink, the lower surface of the pin block and the upper surface of the second heat sink exposed at an outer surface of the hardened insulating material. ### Claim 17 (depends on 16) The method of claim 16, wherein placing the spacer insert within the upper half of the mold comprises placing the spacer insert in contact with the second inner surface and a third inner surface of the upper half of the mold which is perpendicular to the second inner surface, and wherein placing the second sheet in the upper half of the mold comprises placing the second sheet in contact, when the upper half of the mold is coupled to the bottom half of the mold, with an upper surface of the pin block. ### Claim 18 (depends on 17) The method of claim 17, wherein extracting further comprises the upper surface of the pin block being exposed at the outer surface of the hardened insulating material. ### Claim 19 (depends on 16) The method of claim 16, wherein placing a circuit assembly in the bottom half of the mold comprises placing a first circuit assembly and a second circuit assembly in the bottom half of the mold, further comprising: placing a sacrificial joint between the first circuit assembly and the second circuit assembly; extending a septum from the spacer insert between the first circuit assembly and the second circuit assembly. ### Claim 20 (depends on 19) The method of claim 19, further comprising, after extracting, severing the sacrificial joint.