# US 2013/0154148 A1 · Electronic Device And Method Of Making > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0154148 A1 - Document ID: US20130154148A1 - Status: Published application - Kind: A1 - Application number: 13/328,665 - Filed: 2011-12-16 - Published: 2013-06-20 - Earliest claimed: 2011-12-16 - Assignees: Texas Instruments Incorporated - Inventors: Steven Kummerl; Richard J. Saye - Web page: https://patentgrep.com/patent/US20130154148A1 ## CPC - H01F 1/0306: {Metals or alloys, e.g. LAVES phase alloys of the MgCu2-type (H01F1/0304 takes precedence)} - B29C 45/0001: {characterised by the choice of material} - B29C 45/14639: {for obtaining an insulating effect, e.g. for electrical components} - H01F 17/04: with magnetic core - B29K 2995/0008: Magnetic or paramagnetic - H01F 27/2814: {with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets} - H01F 41/0246: {Manufacturing of magnetic circuits by moulding or by pressing powder (magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36)} - H01F 2017/048: {with encapsulating core, e.g. made of resin and magnetic powder} - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS ## Abstract Circuits and methods of fabricating circuits are disclosed herein. A method of fabricating an electronic circuit includes placing an electronic component on a substrate. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound. The mixed mold compound is applied to the substrate by way of a transfer mold process, wherein the mixed mold compound encapsulates the electronic component. ## Claims ### Claim 1 A method of fabricating an electronic circuit, said method comprising: placing an electronic component on a substrate; mixing a ferromagnetic material into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound; applying said mixed mold compound to said substrate by way of a transfer mold process, wherein said mixed mold compound encapsulates said electronic component. ### Claim 2 (depends on 1) The method of claim 1, wherein said electronic component is a coil. ### Claim 3 (depends on 1) The method of claim 1, wherein said placing an electronic component on a substrate comprises: placing a plurality of conductors on said substrate, each of said conductors having a first end and a second end; and electrically connecting a first end of a first conductor to a second end of a second conductor with wire bonds so as to form a coil. ### Claim 4 (depends on 1) The method of claim 1, wherein said ferromagnetic material includes iron. ### Claim 5 (depends on 1) The method of claim 1, wherein said ferromagnetic material includes nickel. ### Claim 6 (depends on 1) The method of claim 1, wherein said ferromagnetic material includes aluminum. ### Claim 7 (depends on 1) The method of claim 1, wherein said ferromagnetic material includes molybdenum. ### Claim 8 (depends on 1) The method of claim 1, wherein said ferromagnetic material includes copper. ### Claim 9 (depends on 1) The method of claim 1, wherein said ferromagnetic material comprises at least one of sendust, permalloy, supermalloy, and molybdenum supermalloy. ### Claim 10 (depends on 1) The method of claim 1, wherein the relative permeability of said mixed mold compound is at least five hundred percent greater than the relative permeability of said mold compound. ### Claim 11 (depends on 1) The method of claim 1, wherein the relative permeability of said mixed mold compound is at least one thousand percent greater than the relative permeability of said mold compound. ### Claim 12 (depends on 1) The method of claim 1, wherein said ferromagnetic material comprises at least ten percent of the weight of said mixed mold compound. ### Claim 13 (depends on 1) The method of claim 1, wherein said ferromagnetic material comprises at least fifteen percent of the weight of said mixed mold compound. ### Claim 14 A transfer mold compound mixture for use in a transfer mold device to encapsulate electronic components, said transfer mold compound mixture comprising a mold compound and at least one ferromagnetic material. ### Claim 15 (depends on 14) The transfer mold compound of claim 14, wherein said ferromagnetic material comprises at least one of sendust, permalloy, supermalloy, and molybdenum supermalloy. ### Claim 16 (depends on 14) The method of claim 14, wherein the relative permeability of the mixed transfer mold compound is at least five hundred percent greater than the relative permeability of said mold compound. ### Claim 17 (depends on 14) The method of claim 14, wherein the relative permeability of the mixed transfer mold compound is at least one thousand percent greater than the relative permeability of said mold compound. ### Claim 18 (depends on 14) The method of claim 14, wherein said ferromagnetic material comprises at least ten percent of the weight of said mixed mold compound. ### Claim 19 (depends on 14) The method of claim 14, wherein said ferromagnetic material comprises at least fifteen percent of the weight of said mixed mold compound. ### Claim 20 A method of fabricating inductors, said method comprising: forming a plurality of coils on a substrate; mixing a ferromagnetic material with a transfer mold compound to provide a mixed transfer mold compound; applying said mixed transfer mold compound to said coil via a transfer mold process to encapsulate said plurality of coils; and singulating individual ones of the encapsulated coils into individual inductors.