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US 2013/0154143 A1Published application
High dynamic temperature control system
AssigneeWatlow Electric Manufacturing Company
InventorsMartin WALLINGER, Gerhard Schefbänker, Wolfgang Pöschl, Gernot Antosch, Reinhardt Lehnert, Michael Kübler, August Burr
Life of this patent
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Abstract
A heating/cooling module for a molding system includes a mold surface forming a part of a mold cavity. A cooling unit is disposed adjacent to the mold surface for cooling the mold surface. A layered heater is disposed adjacent to the mold surface for heating the mold surface.
Claims24
A heating/cooling module for a molding system comprising:
- a mold surface defining a part of a mold cavity;
- a cooling unit disposed adjacent to the mold surface for cooling the mold surface;
- and
- a layered heater formed adjacent to the mold surface for heating the mold surface.
1 more element
A heating/cooling module for heating and cooling a target, comprising:
- a heating/cooling surface disposed proximate the target;
- a layered heater that heats the target through the heating/cooling surface;
- and
- a cooling unit that cools the target through the heating/cooling surface,
- wherein the layered heater is integrally formed with the cooling unit to form an integrated unit, and the heating/cooling surface is a surface of one of the layered heater and the cooling unit.
2 more elements
Dependencies are inferred from the claim text.