# US 2013/0154136 A1 · Method and device for forming reflector in light emitting device package

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2013/0154136 A1
- Document ID: US20130154136A1
- Status: Published application
- Kind: A1
- Application number: 13/714,469
- Filed: 2012-12-14
- Published: 2013-06-20
- Earliest claimed: 2011-12-16
- Assignees: Samsung Electronics Co., Ltd.
- Inventors: Tae Jun KIM; Sang Bok YUN; Min Young SON; Choong Hwan KWON; Sung Ho PARK
- Web page: https://patentgrep.com/patent/US20130154136A1

## CPC

- B29D 11/0074: {Production of other optical elements not provided for in B29D11/00009- B29D11/0073}
- B29D 11/00605: {Production of reflex reflectors}
- B29D: PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE (making granules B29B9/00; making preforms B29B11/00)

## Abstract

A method of forming a plurality of reflectors for a light emitting device (LED) package includes receiving a first fluid material at at least a first source opening of an upper mold of a transfer apparatus; passing the first fluid material through a transfer passageway of the upper mold; expelling the first fluid material from the transfer passageway through a plurality of openings in a lower internal surface of a transfer chamber of the transfer passageway; depositing the first fluid material on a lead frame, disposed on a lower mold of the transfer apparatus, through the plurality of openings; forming the first fluid material into a plurality of molded structures using the upper mold and the lower mold; and hardening each of the molded structures to form a plurality of reflectors.

## Claims

### Claim 1

A method of forming a plurality of reflectors for a light emitting device (LED) package, the method including:
receiving a first fluid material at at least a first source opening of an upper mold of a transfer apparatus;
passing the first fluid material through a transfer passageway of the upper mold;
expelling the first fluid material from the transfer passageway through a plurality of openings in a lower internal surface of a transfer chamber of the transfer passageway;
depositing the first fluid material on a lead frame, disposed on a lower mold of the transfer apparatus, through the plurality of openings;
forming the first fluid material into a plurality of molded structures using the upper mold and the lower mold; and
hardening each of the molded structures to form a plurality of reflectors.

### Claim 2 (depends on 1)

The method of claim 1, wherein:
the transfer chamber includes an upper internal surface opposite the lower internal surface, wherein the upper internal surface is not parallel to the lower internal surface.

### Claim 3 (depends on 1)

The method of claim 1, wherein:
the upper mold includes a lower-most external surface, wherein the lower-most external surface of the upper mold is not parallel to the lower internal surface of the transfer chamber.

### Claim 4 (depends on 3)

The method of claim 3, wherein:
the lower-most external surface of the upper mold forms an angle between 0.1 and 5 degrees with respect to the lower internal surface of the transfer chamber.

### Claim 5 (depends on 1)

The method of claim 1, wherein:
depositing the first fluid material on the lead frame through the plurality of openings includes passing the first fluid material through a plurality of respective holes, each hole extending at least from a respective cavity in the upper mold to a respective opening of the plurality of openings.

### Claim 6 (depends on 5)

The method of claim 5, wherein:
each hole extends from a respective cavity past a respective opening, such that a bottom end of the hole is at the respective cavity, and the opposite, top end of the hole is located in the transfer chamber.

### Claim 7 (depends on 6)

The method of claim 6, wherein:
each hole is formed of a nozzle.

### Claim 8 (depends on 7)

The method of claim 7, wherein:
each nozzle has the same shape and size.

### Claim 9 (depends on 6)

The method of claim 6, wherein:
the distance between the bottom end of each hole and an opening in the lower internal surface of the transfer chamber in a vertical direction is smaller for holes closer to the first source opening than for holes further from the first source opening.

### Claim 10 (depends on 1)

The method of claim 1, wherein:
the transfer chamber has an elongated tubular shape extending from a first end at the first source opening to a second end opposite the first source opening; and
the plurality of openings in the lower internal surface of the transfer chamber extend in a linear direction along the length of the transfer chamber.

### Claim 11 (depends on 1)

The method of claim 1, further comprising:
forming the first fluid material into the plurality of molded structures by pressing the upper mold toward the lower mold.

### Claim 12

A method of forming a plurality of reflectors for a light emitting device (LED) package, the method including:
receiving a first fluid material at at least a first source opening of an upper mold of a transfer apparatus;
passing the first fluid material through a transfer chamber of the upper mold;
expelling the first fluid material from the transfer chamber through a plurality of openings in a lower internal surface of the transfer chamber;
depositing some of the first fluid material on a lead frame disposed on a lower mold of the transfer apparatus through a first opening of the plurality of openings, and depositing some of the first fluid material on a lead frame disposed on the lower mold of the transfer apparatus through a second opening of the plurality of openings;
forming the first fluid material into a plurality of molded structures by pressing the upper mold toward the lower mold; and
hardening each of the molded structures to form a plurality of reflectors.

### Claim 13 (depends on 12)

The method of claim 12, further comprising:
depositing some of the first fluid material on the lead frame through a first hole that extends at least from the first opening to a first cavity in the upper mold, and
depositing some of the first fluid material on the lead frame through a second hole that extends at least from the second opening to a second cavity in the upper mold.

### Claim 14 (depends on 13)

The method of claim 13, wherein:
the first hole extends from the first cavity past the first opening, such that a bottom end of the first hole is at the first cavity, and the opposite, top end of the first hole is located in the transfer chamber; and
the second hole extends from the second cavity past the second opening, such that a bottom end of the second hole is at the second cavity, and the opposite, top end of the second hole is located in the transfer chamber.

### Claim 15 (depends on 14)

The method of claim 14, wherein:
the first hole is a first distance from the first source opening in a horizontal direction;
the second hole is a second distance from the source opening in a horizontal direction, the second distance being greater than the first distance; and
the distance in the vertical direction between the first opening and the bottom end of the first hole is smaller than the distance in the vertical direction between the second opening and the bottom end of the second hole.

### Claim 16 (depends on 12)

The method of claim 12, wherein:
the upper mold includes a lower-most external surface, wherein the lower-most external surface of the upper mold is not parallel to at least one of the lower internal surface of the transfer chamber and an opposite upper internal surface of the transfer chamber.

### Claim 17 (depends on 16)

The method of claim 16, wherein:
the lower-most external surface of the upper mold forms an angle between 0.1 and 5 degrees with respect to at least one of the lower internal surface of the transfer chamber and the opposite upper internal surface of the transfer chamber.

### Claim 18

An apparatus for forming a reflector for a light emitting device (LED) package, the apparatus comprising:
an upper mold including:
an upper-most external surface,
a lower-most external surface,
at least a first source opening configured to receive a first material,
a transfer chamber extending from an upper internal surface of the upper mold to a lower internal surface of the upper mold,
a plurality of discharge openings in the lower internal surface, the plurality of discharge openings configured to expel the first material, and
a plurality of cavities, each cavity corresponding to a respective discharge opening, each cavity formed in a shape used for molding; and
a lower mold including:
an upper-most external surface; and
a lower-most external surface,
the lower mold configured to support a lead frame onto which the first material is to be deposited using the transfer chamber.

### Claim 19 (depends on 18)

The apparatus of claim 18, wherein:
at least one of the upper internal surface and the lower internal surface of the upper mold is not parallel to the lower-most external surface of the upper mold.

### Claim 20 (depends on 18)

The apparatus of claim 18, further comprising:
a plurality of holes extending between the transfer chamber and the plurality of cavities, each hole corresponding to a respective cavity,
wherein the cross-sectional configuration of each opening-hole-cavity grouping between the lower-most external surface of the upper mold and the upper internal surface of the upper mold differs based on a horizontal distance from the first source opening.
