# US 2013/0154130 A1 · Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2013/0154130 A1 - Document ID: US20130154130A1 - Status: Published application - Kind: A1 - Application number: 13/819,983 - Filed: 2011-08-29 - Published: 2013-06-20 - Earliest claimed: 2010-09-06 - Assignees: Heraeus Noblelight GmbH - Inventors: Michael Peil; Florin Oswald; Harald Maiweg - Web page: https://patentgrep.com/patent/US20130154130A1 ## CPC - H10H 20/853: characterised by their shape - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H10F 39/107: {having multiple elements covered by H10F30/00 in a repetitive configuration, e.g. radiation detectors comprising photodiode arrays} - H10F 77/407: {indirectly associated with the devices} - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 29/10: Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 (active-matrix LED displays H10H29/30) - H10W 74/01: Manufacture or treatment - H10W 74/114: {by a substrate and the encapsulations} - H10W 76/47: Solid or gel fillings - F21K 9/90: Methods of manufacture - F21Y 2115/10: Light-emitting diodes [LED] - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 2201/0108: Transparent - H05K 2201/0162: Silicon containing polymer, e.g. silicone - H05K 2201/0175: Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor - H05K 2201/09909: Special local insulating pattern, e.g. as dam around component - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10121: Optical component, e.g. opto-electronic component - H05K 2201/10151: Sensor - H05K 2203/0126: Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes - H10H 20/0362: {of encapsulations} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone. ## Claims ### Claim at position 1 -14. (canceled) ### Claim 15 A method for coating an optoelectronic chip-on-board module, comprising a flat substrate populated with at least one optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of at least one silicone, the method comprising the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses at least a partial surface area of the substrate to be coated, the dam comprising a first, heat-curable, highly reactive silicone curable at the first temperature; c) filling the at least partial surface area enclosed by the dam on the substrate with a liquid second silicone; and d) curing the second silicone. ### Claim 16 (depends on 15) The method according to claim 15, wherein after step b) and before step c), the substrate is cooled and/or allowed to cool down to a second temperature lying below the first temperature. ### Claim 17 (depends on 16) The method according to claim 16, wherein the second temperature lies below a curing temperature of the second silicone. ### Claim 18 (depends on 15) The method according to claim 15, wherein the second silicone is no more reactive than the first silicone used for generating a dam. ### Claim 19 (depends on 15) The method according to claim 15, wherein the first silicone and the second silicone comprise the same silicone. ### Claim 20 (depends on 15) The method according to claim 15, wherein the dam is applied at least in some sections on an edge of the substrate. ### Claim 21 (depends on 15) The method according to claim 15, wherein the dam is applied over optoelectronic components, bonding wires, or other components. ### Claim 22 (depends on 15) The method according to claim 15, wherein the dam is applied with a cross-sectional profile that causes an optical focusing or scattering of light. ### Claim 23 (depends on 15) The method according to claim 15, wherein at least one optically functional material is mixed into at least one of the first silicone and the second silicone. ### Claim 24 (depends on 23) The method according to claim 23, wherein the at least one optically functional material comprises a phosphorescing and/or scattering material or particle. ### Claim 25 (depends on 15) The method according to claim 15, wherein drops of the first silicone are applied as quickly curing lenses on individual optoelectronic components of the substrate. ### Claim 26 An optoelectronic chip-on-board module, comprising a flat substrate populated with at least one optoelectronic components, the module having a transparent, UV-resistant, and temperature-resistant coating made of at least one silicone, wherein the coating comprises a dam enclosing at least a partial surface area of the substrate, the dam comprising a cured first silicone, and a second silicone filled in and cured in the at least partial surface area. ### Claim 27 (depends on 26) The optoelectronic chip-on-board module according to claim 26, wherein the dam runs at least in some sections to an edge of the substrate. ### Claim 28 (depends on 26) The optoelectronic chip-on-board module according to claim 26, wherein the first silicone and the second silicone comprise the same silicone. ### Claim 29 (depends on 28) The optoelectronic chip-on-board module according to claim 28, wherein the first silicone and the second silicone have, in a cured state, the same optical properties with regard to at least one of transparency, color, and refractive index. ### Claim 30 (depends on 26) The optoelectronic chip-on-board module according to claims 26, wherein the substrate is populated with optoelectronic components up to an edge or up to shortly before an edge of the substrate. ### Claim 31 (depends on 15) An optoelectronic chip-on-board module produced according to the method of claim 15. ### Claim 32 (depends on 26) A system comprising at least two optoelectronic chip-on-board modules according to claim 26, wherein adjacent substrates of the optoelectronic chip-on-board modules have edges arranged flush with each other, and wherein the adjacent substrates are populated with optoelectronic components up to the flush edges, such that a regular arrangement and spacing of optoelectronic components results, even across boundaries between the adjacent substrates.